Yu-Peng Tsai | Researchain

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Featured researches published by Yu-Peng Tsai.

Archive | 2011

Packaging Methods and Structures for Semiconductor Devices

Chih-Wei Lin; Ming-Da Cheng; Wen-Hsiung Lu; Hsiu-Jen Lin; Bor-Ping Jang; Chung-Shi Liu; Mirng-Ji Lii; Chen-Hua Yu; Meng-Tse Chen; Chun-Cheng Lin; Yu-Peng Tsai; Kuei-Wei Huang; Wei-Hung Lin

Archive | 2014

Packaging methods and packaged semiconductor devices

Meng-Tse Chen; Wei-Hung Lin; Yu-Peng Tsai; Chun-Cheng Lin; Chih-Wei Lin; Ming-Da Cheng; Chung-Shi Liu

Archive | 2013

Apparatus and Method for Wafer Separation

Yu-Peng Tsai; Wen-Hsiung Lu; Cheng-Ting Chen; Hsien-Wei Chen; Ming-Da Cheng; Chung-Shi Liu

Archive | 2013

Directly Sawing Wafers Covered with Liquid Molding Compound

Yu-Peng Tsai; Wen-Hsiung Lu; Chia-Wei Tu; Ming-Da Cheng; Chung-Shi Liu

Archive | 2015

Packages and Methods for Forming the Same

Meng-Tse Chen; Chun-Cheng Lin; Yu-Peng Tsai; Hsiu-Jen Lin; Ming-Da Cheng; Chung-Shi Liu

Archive | 2011

SEMICONDUCTOR PACKAGE HAVING SOLDER JOINTED REGION WITH CONTROLLED AG CONTENT

Ming-Da Cheng; Kuei-Wei Huang; Yu-Peng Tsai; Cheng-Ting Chen; Hsiu-Jen Lin; Chung-Shi Liu

Archive | 2011

Package-on-Package Process for Applying Molding Compound

Meng-Tse Chen; Wei-Hung Lin; Sheng-Yu Wu; Chun-Cheng Lin; Kuei-Wei Huang; Yu-Peng Tsai; Chih-Wei Lin; Wen-Hsiung Lu; Hsiu-Jen Lin; Bor-Ping Jang; Ming-Da Cheng; Chung-Shi Liu

Archive | 2014