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Dive into the research topics where Yuichi Oda is active.

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Featured researches published by Yuichi Oda.


Welding International | 2017

Heat dissipative Pb-free bonding technology using Al-rich Zn/Al/Zn clad solder

Takuto Yamaguchi; Tomotake Tohei; Osamu Ikeda; Shohei Hata; Yuichi Oda; Kazuma Kuroki; Hiromitsu Kuroda; Akio Hirose

Abstract Al-rich Zn/Al/Zn clad solder were developed as Pb-free solder for a die-attachment. The Zn/Al/Zn clad solder was produced by clad rolling of Zn and Al strips in order to prevent Al from oxidation and improve wettability. The Zn/Al/Zn clad solder was melted at 382°C after solid-state interdiffusion of the Zn and Al layers. Bonding was successfully achieved with bonding pressure of a few kilopascals. Thermal cycle life of Invar-to-Cu substrate joint using the Zn/Al/Zn clad solder was longer than that of Pb-Sn-Ag solder. No Kirkendall voids were observed in the vicinity of the bonded interface after ageing at 250 °C for 1000 h.


Archive | 2011

Junction material, manufacturing method thereof, and manufacturing method of junction structure

Takuto Yamaguchi; Masahide Okamoto; Osamu Ikeda; Hiromitsu Kuroda; Kazuma Kuroki; Shohei Hata; Yuichi Oda


Archive | 2011

Junction material, method for manufacturing the same, and method for manufacturing junction structure

Shohei Hata; Yasushi Ikeda; Hiromitsu Kuroda; Kazuma Kuroki; Yuichi Oda; Masahide Okamoto; Takuto Yamaguchi; 祐一 小田; 拓人 山口; 正英 岡本; 靖 池田; 昌平 秦; 一真 黒木; 洋光 黒田


Journal of Electronic Materials | 2015

Three-Layer Zn/Al/Zn Clad Solder for Die Attachment

Takuto Yamaguchi; Osamu Ikeda; Yuichi Oda; Shohei Hata; Kazuma Kuroki; Hiromitsu Kuroda; Akio Hirose


Archive | 2010

High heat resistant bonding material and semiconductor device using the same

Shohei Hata; Hiromitsu Kuroda; Kazuma Kuroki; Yuichi Oda; Yukio Suzuki; 祐一 小田; 昌平 秦; 幸夫 鈴木; 一真 黒木; 洋光 黒田


The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits | 2013

Cu-Coated Zn/Al Clad Solder for High Temperature Die Attachment

Takuto Yamaguchi; Osamu Ikeda; Shohei Hata; Yuichi Oda; Kazuma Kuroki


Archive | 2012

Lead component and method for manufacturing the same, and semiconductor package

Shohei Hata; Yuichi Oda; Kazuma Kuroki; Hiromitsu Kuroda


Journal of Electronic Materials | 2015

Effects of Bonding Conditions on Bondability Using Zn/Al/Zn Clad Solder

Takuto Yamaguchi; Osamu Ikeda; Yuichi Oda; Shohei Hata; Kazuma Kuroki; Hiromitsu Kuroda; Akio Hirose


Archive | 2014

SOLDER JOINT MATERIAL AND METHOD OF MANUFACTURING THE SAME

Yuichi Oda; Hideyuki Sagawa; Kazuma Kuroki; Hiromitsu Kuroda; Kotaro Tanaka; Hiroaki Numata


Archive | 2014

Semiconductor module and joint material

Takuto Yamaguchi; 拓人 山口; Masahide Okamoto; 正英 岡本; Yasushi Ikeda; 靖 池田; Hiromitsu Kuroda; 洋光 黒田; Kazuma Kuroki; 一真 黒木; Shohei Hata; 昌平 秦; Yuichi Oda; 祐一 小田

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