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Featured researches published by Shohei Hata.


Welding International | 2017

Heat dissipative Pb-free bonding technology using Al-rich Zn/Al/Zn clad solder

Takuto Yamaguchi; Tomotake Tohei; Osamu Ikeda; Shohei Hata; Yuichi Oda; Kazuma Kuroki; Hiromitsu Kuroda; Akio Hirose

Abstract Al-rich Zn/Al/Zn clad solder were developed as Pb-free solder for a die-attachment. The Zn/Al/Zn clad solder was produced by clad rolling of Zn and Al strips in order to prevent Al from oxidation and improve wettability. The Zn/Al/Zn clad solder was melted at 382°C after solid-state interdiffusion of the Zn and Al layers. Bonding was successfully achieved with bonding pressure of a few kilopascals. Thermal cycle life of Invar-to-Cu substrate joint using the Zn/Al/Zn clad solder was longer than that of Pb-Sn-Ag solder. No Kirkendall voids were observed in the vicinity of the bonded interface after ageing at 250 °C for 1000 h.


Archive | 2009

Substrate for mounting electronic part and electronic part

Shohei Hata; Naoki Matsushima; Takeru Fujinaga


Archive | 2004

Anodic bonding method and electronic device having anodic bonding structure

Shohei Hata; Hideo Sotokawa; Hiroaki Furuichi


Archive | 2008

Functional Device Package

Shohei Hata; Naoki Matsushima; Eiji Sakamoto; Ryoji Okada; Takanori Aono; Atsushi Kazama; Toshiki Kida


Archive | 2008

Surface light source module, back light unit, and liquid crystal display device

Shohei Hata; Susumu Ishida; 進 石田; 昌平 秦


Archive | 2003

Optical module and method for manufacturing optical module

Naoki Matsushima; Hideo Sotokawa; Hideyuki Kuwano; Yoshiaki Niwa; Keiichi Yamada; Masahiro Hirai; Kazumi Kawamoto; Shohei Hata; Toshiaki Takai


Archive | 2010

LED LIGHT SOURCE, ITS MANUFACTURING METHOD, AND LED-BASED PHOTOLITHOGRAPHY APPARATUS AND METHOD

Susumu Ishida; Shohei Hata


Archive | 2007

Function element package

Takanori Aono; Shohei Hata; Atsushi Kazama; Toshiki Kida; Naoki Matsushima; Ryoji Okada; Eiji Sakamoto; 英次 坂本; 亮二 岡田; 年紀 木田; 直樹 松嶋; 昌平 秦; 宇紀 青野; 敦 風間


Archive | 2011

Junction material, manufacturing method thereof, and manufacturing method of junction structure

Takuto Yamaguchi; Masahide Okamoto; Osamu Ikeda; Hiromitsu Kuroda; Kazuma Kuroki; Shohei Hata; Yuichi Oda


Archive | 2007

Electronic component mounting method, and electronic component substrate mounting structure

Takeshi Fujinaga; Shohei Hata; Toshiaki Koizumi; Eiji Sakamoto; Hideaki Takemori; 英次 坂本; 俊晃 小泉; 昌平 秦; 英昭 竹盛; 猛 藤永

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