Yukako Tsutsumi

A triangular loop antenna mounted adjacent to a lossy Si substrate for millimeter-wave wireless PAN

Millimeter-wave wireless communication is expected to be used for wireless personal area network (WPAN) for which a bit rate of 1Gbps or more is needed. Our goal is the development of an antenna suited to a WPAN terminal. Since a small, low-cost antenna with high radiation efficiency and a high gain in a wide- angle range is required for WPAN, the beam scan becomes unnecessary. In this paper, we propose a novel triangular loop antenna with a simple structure which has a feed point on to a semiconductor substrate.

A 60-GHz CMOS Receiver with Frequency Synthesizer

A 60-GHz receiver (RX) chip fabricated in 90 nm CMOS process is reported. The RX chip consists of an LNA, a downconversion mixer and a phase-locked loop synthesizer. The RX chip is capable of generating LO signal from phase-locked synthesizer. Measured power gain and NF of 22 dB and 8.4 dB were obtained at 61.5 GHz. These results indicate the possibility of realization of CMOS single-chip 60-GHz transceiver.

20.4 A fully integrated single-chip 60GHz CMOS transceiver with scalable power consumption for proximity wireless communication

A fully-integrated single-chip CMOS transceiver with MAC and PHY for 60GHz proximity wireless communication is presented. A 60GHz wireless communication single-chip transceiver has not yet been reported due to large power consumption issues. However, by limiting the application to high-throughput proximity transmission, thermal issues arising in a single-chip have been overcome. A 2GHz broadband OFDM single-chip transceiver suffers from SNR degradation due to the reference clock (REFCLK) and baseband clock (BBCLK) spurs in RF/analog circuits. Low frequency spurs in the clock generator (CLKPLL) due to the mixing of the ADC/DAC sampling clock (SCLK) and other clocks such as REFCLK and BBCLK have been eliminated by careful frequency planning of those clocks. In addition to that, spur suppression in digital baseband and noise-tolerant RF/analog circuit designs are employed. The spurs have been successfully suppressed to less than -35dBc. The chip achieves a PHY data-rate of 2.35Gb/s and MAC throughput of 2.0Gb/s at a distance of 4cm. Power consumption is scalable to the throughput by the introduction of fast Sleep and Awake modes. The average power consumption at a throughput of 0.2Gb/s is reduced to 36% of that at 2.0Gb/s.

Bonding wire loop antenna built into standard BGA package for 60 GHz short-range wireless communication

The unlicensed 60 GHz frequency band is suitable for high-speed wireless systems with transmission rates of 1 Gbps or more. In this paper, we propose a bonding wire antenna built into a BGA package for 60 GHz short-range wireless communication. This antenna utilizes two bonding wires and a metal plate on an interposer in a BGA package and has a loop shape. The proposed antenna is built into a standard BGA package without special modification, so that it can be fabricated at low cost by conventional BGA package fabrication process. The first and unique evaluation of the antenna fully sealed by encapsulation resin was done by measurement. We describe the operation mechanism of the proposed antenna, the design procedure and the measurement results.

Low profile double resonance frequency tunable antenna using RF MEMS variable capacitor for digital terrestrial broadcasting reception

It is difficult to realize the built-in antenna for wideband systems, because a frequency bandwidth of the low profile antenna is narrow. A frequency tunable antenna is a technique for wideband characteristics. In this paper a low profile double resonance frequency tunable antenna using MEMS variable capacitors is presented. It has high efficiency over a wide frequency band. Through both resonant portions from 465 to 665 MHz, the efficiency of more than −4 dB and the VSWR of less than 3 are observed in the measurement using the variable capacitor of 0.4–0.9 pF.

Millimeter-wave band slot antenna on shielded BGA package

High-speed short-range wireless communication systems utilizing the 60-GHz band are expected. An installation of a 60-GHz transceiver into a mobile terminal with high packaging density is one of the promising usages. Electromagnetic noise in the mobile terminals is an important issue, because it may degrade the communication quality of the 60-GHz transceiver. This paper presents a novel antenna-in-package solution realizing both efficient radiation of millimeter waves and high shielding effectiveness to electromagnetic noises. The antenna is composed of U-shaped slots cut on the shielded ball grid array package. The antenna is designed to have a wide-angle radiation characteristic in the horizontal plane. The measured antenna gain of the fabricated antenna is from 2.9 to 5.2 dBi in the frequency range from 57 to 65 GHz.