Zlatko Sitar

Growth of cubic phase gallium nitride by modified molecular‐beam epitaxy

Gallium nitride is a compound semiconductor with a wide direct band gap (3.45 eV) and a large saturated electron drift velocity. Nearly all single‐crystal thin films grown to date have been wurtzite (hexagonal) structure. Cubic GaN has the potential for higher saturated electron drift velocity and somewhat lower band gap. These properties could increase its applicability for high‐frequency devices (such as impact ionization avalanche transit time diodes) as well as short‐wavelength light emitting diodes and semiconductor lasers. This paper reports the growth of cubic phase single‐crystal thin‐film GaN using a modified molecular‐beam epitaxy technique. A standard effusion cell was used for gallium, but to activate nitrogen gas prior to deposition, a microwave glow discharge was used. Auger electron spectroscopy showed a nominally stoichiometric GaN film. Transmission electron microscopy with selected area diffraction indicated the crystal structure to be zinc blende.

Growth of AlN/GaN layered structures by gas source molecular‐beam epitaxy

AlN/GaN layered structures with layer periods between 1.5 and 40 nm have been grown on (0001) oriented sapphire and α(6H)‐SiC substrates. The growth was performed using a modified gas source molecular‐beam epitaxy (MBE) technique. Standard effusion cells were used as sources of Al and Ga, and a small, MBE compatible, electron cyclotron resonance (ECR) plasma source was used to activate nitrogen gas prior to deposition. Chemical analysis of the layers was conducted using Auger spectrometry. X‐ray diffractometry, transmission electron microscopy (TEM), and high‐resolution electron microscopy (HREM) were employed for the structural and microstructural studies. Coherent interfaces (no relaxation by misfit dislocations) were observed for bilayer periods smaller than 6 nm. By contrast, completely relaxed individual layers of GaN and AlN with respect to each other were present for bilayer periods above 20 nm. Cathodoluminescence showed a shift in the emission peak from 3.42 eV for the sample with individual 10‐n...

The growth and optical properties of large, high-quality AlN single crystals

The effect of impurities and defects on the optical properties of AlN was investigated. High-quality AlN single crystals of more than 20mm2 size were examined. Different crucible materials and growth procedures were applied to the growth of bulk AlN by physical vapor transport method to vary the defect and the impurity concentrations. The crystalline orientation was investigated by Raman spectroscopy. Glow discharge mass spectrometry was used to determine the trace concentration of the incorporated impurities such as oxygen and carbon. The photoluminescence emission and absorption properties of the crystals revealed bands around 3.5 and 4.3eV at room temperature. Absorption edges ranging between 4.1 and 5.95eV were observed. Since no straight correlation of the oxygen concentration was obtained, a major contribution of oxygen or oxygen-related impurities was ruled out to generate the observed emission and absorption bands in the Ultraviolet spectral range. The carbon-related impurities and intrinsic defec...

Sublimation growth and characterization of bulk aluminum nitride single crystals

Single crystalline platelets of aluminum nitride (AlN) ⩽ 1 mm thick have been grown within the temperature range of 1950–2250°C on 10 × 10 mm2 α(6H)-silicon carbide (SiC) substrates via sublimation-recondensation in a resistively heated graphite furnace. The source material was sintered AlN. A maximum growth rate of 500 μm/h was achieved at 2150°C and a source-to-seed separation of 4 mm. Growth rates below 2000°C were approximately one order of magnitude lower. Crystals grown at high temperatures ranged in color from blue to green due to the incorporation of Si and C from the SiC substrates; those grown at lower temperatures were colorless and transparent. Secondary-ion mass spectroscopy (SIMS) results showed almost a two order of magnitude decrease in the concentrations of these two impurities in the transparent crystals. Plan view transmission electron microscopy (TEM) of these crystals showed no line or planar defects. Raman spectroscopy and X-ray diffraction (XRD) studies indicated a strain free material.

Interface chemistry and surface morphology in the initial stages of growth of GaN and AlN on α-SiC and sapphire

Abstract The morphology and interface chemistry occurring during the initial stages of growth of GaN and AlN layers on α(6H)-SiC and sapphire have been examined. Films were grown using gas source molecular beam epitaxy (MBE) equipment containing an electron cyclotron resonance (ECR) plasma source to activate molecular nitrogen. The experiments consisted of sequential depositions of approximately one monolayer followed by X-ray photoelectron spectroscopy (XPS) analysis. Evidence for silicon nitride formation on the SiC surface was obtained from the studies of both the Si oxidation states and the substrate peak intensity dependence on film thickness. The growth of GaN on sapphire appeared to occur via Stranski-Krastanov mode, while the growth on SiC showed characteristics of three-dimensional growth. AlN grew in a layer-by-layer mode on both substrates.

Surface preparation and homoepitaxial deposition of AlN on (0001)-oriented AlN substrates by metalorganic chemical vapor deposition

Chemical surface treatments were conducted on mechanically polished (MP) and chemomechanically polished (CMP) (0001)-oriented single crystalline aluminum nitride (AlN) substrates to determine a surface preparation procedure for the homoepitaxial deposition of AlN epitaxial layers by metalorganic chemical vapor deposition. MP AlN substrates characterized by atomic force microscopy exhibited 0.5 nm rms roughness and polishing scratches, while CMP AlN substrates exhibited 0.1 nm rms roughness and were scratch-free. X-ray photoelectron spectroscopy analysis of MP and CMP AlN substrates indicated the presence of a surface hydroxide layer composed of mixed aluminum oxide hydroxide and aluminum trihydroxide. Wet etching with sulfuric and phosphoric acid mixtures reduced the amount of surface hydroxide. Ammonia annealing at 1250 °C converted the substrate hydroxide layer to AlN and increased the rms roughness of MP and CMP AlN substrates to 2.2 nm and 0.2 nm, respectively. AlN epitaxial layers were deposited at 1...

Influence of gallium supersaturation on the properties of GaN grown by metalorganic chemical vapor deposition

A thermodynamic supersaturation model for gallium (Ga) was developed to describe GaN growth characteristics in low-pressure metalorganic chemical vapor deposition. The model takes into account the simplified GaN chemical reaction that occurs at the growth interface, Ga+NH3=GaN+3/2H2. The supersaturation was varied in two ways: (1) by the V/III ratio and (2) by the choice of the diluent gas. Two diluent gases were considered: H2, a commonly used diluent gas, and N2, a reaction inert gas. The choice of the diluent played a role in the degree of Ga supersaturation; since H2 is the product in the GaN formation, the addition of hydrogen significantly lowered the supersaturation. Atomic force microscopy revealed that surface morphology was associated with the different Ga supersaturation and the Burton–Cabrera–Frank model was used to relate it to the observed spiral size and terrace width. In addition to growth morphology, the degree of Ga supersaturation also influenced the carrier compensation level in n-type...

Deep-Ultraviolet Light-Emitting Diodes Fabricated on AlN Substrates Prepared by Hydride Vapor Phase Epitaxy

AlGaN-based deep-ultraviolet light-emitting diodes (DUV-LEDs) were fabricated on AlN substrates. The AlN substrates were prepared by growing thick hydride vapor phase epitaxy (HVPE)-AlN layers on bulk AlN substrates prepared by physical vapor transport (PVT). After growing an LED structure, the PVT-AlN substrates were removed by mechanical polishing. This process allowed the fabrication of DUV-LEDs on HVPE-AlN substrates with high crystalline quality and DUV optical transparency. The DUV-LEDs exhibited a single emission peaking at 268 nm through the HVPE-AlN substrates. The output power as high as 28 mW was obtained at an injection current of 250 mA.

Growth and Characterization of AlN and AlGaN Epitaxial Films on AlN Single Crystal Substrates

AlN and AlGaN epitaxial films were deposited by metal organic chemical vapor deposition on single crystal AlN substrates processed from AlN boules grown by physical vapor transport. Structural, chemical, and optical characterization demonstrated the high crystalline quality of the films and interfaces.

On the origin of the 265 nm absorption band in AlN bulk crystals

Single crystal AlN provides a native substrate for Al-rich AlGaN that is needed for the development of efficient deep ultraviolet light emitting and laser diodes. An absorption band centered around 4.7 eV (∼265 nm) with an absorption coefficient above 1000 cm−1 is observed in these substrates. Based on density functional theory calculations, substitutional carbon on the nitrogen site introduces absorption at this energy. A series of single crystalline wafers were used to demonstrate that this absorption band linearly increased with carbon, strongly supporting the model that CN- is the predominant state for carbon in AlN.