Alan J. Magnus

Stacked semiconductor device assembly and method for forming

ELECTRONIC DEVICES WITH EMBEDDED DIE INTERCONNECT STRUCTURES, AND METHODS OF MANUFACTURE THEREOF

Redistributed chip packages containing multiple components and methods for the fabrication thereof

Electrical coupling of wafer structures

Semiconductor device package having backside contact and method for manufacturing

Semiconductor device package and method of manufacture

Methodology for processing a panel during semiconductor device fabrication

Wafer level packages having non-wettable solder collars and methods for the fabrication thereof

Shielding MEMS structures during wafer dicing

WAFER LEVEL PACKAGES AND METHODS FOR PRODUCING WAFER LEVEL PACKAGES HAVING DELAMINATION-RESISTANT REDISTRIBUTION LAYERS