Michael B. Vincent

Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof

MICROELECTRONIC PACKAGES CONTAINING STACKED MICROELECTRONIC DEVICES AND METHODS FOR THE FABRICATION THEREOF

EMI/RFI SHIELDING FOR SEMICONDUCTOR DEVICE PACKAGES

Microelectronic packages having embedded sidewall substrates and methods for the producing thereof

Microelectronic packages having mold-embedded traces and methods for the production thereof

MICROELECTRONIC PACKAGES HAVING SIDEWALL-DEPOSITED HEAT SPREADER STRUCTURES AND METHODS FOR THE FABRICATION THEREOF

Microelectronic packages having trench vias and methods for the manufacture thereof

Devices and stacked microelectronic packages with parallel conductors and intra-conductor isolator structures and methods of their fabrication

Devices and stacked microelectronic packages with package surface conductors and adjacent trenches and methods of their fabrication

Devices and stacked microelectronic packages with package surface conductors and methods of their fabrication