Jason R. Wright

Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof

SEMICONDUCTOR DEVICE PACKAGING USING ENCAPSULATED CONDUCTIVE BALLS FOR PACKAGE-ON-PACKAGE BACK SIDE COUPLING

Semiconductor device packaging having pre-encapsulation through via formation using drop-in signal conduits

Capped device interconnect in a semiconductor package

Microelectronic packages having mold-embedded traces and methods for the production thereof

Devices and stacked microelectronic packages with package surface conductors and adjacent trenches and methods of their fabrication

Method for packaging an electronic device assembly having a capped device interconnect

Methodology for processing a panel during semiconductor device fabrication

WAFER LEVEL PACKAGES AND METHODS FOR PRODUCING WAFER LEVEL PACKAGES HAVING DELAMINATION-RESISTANT REDISTRIBUTION LAYERS

3D RCP Package Stacking: Side Connect, An Emerging Technology for System Integration and Volumetric Efficiency