Allen Zhao
Applied Materials
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Publication
Featured researches published by Allen Zhao.
Japanese Journal of Applied Physics | 1999
Peter K. Loewenhardt; Wade Zawalski; Yan Ye; Allen Zhao; Tim R. Webb; Daisuke Tajima; Diana X. Ma
The importance of plasma diagnostics at semiconductor equipment manufacturers has increased steadily over the past decade. The design and procurement of advanced etching tools now require a full host of plasma diagnostics and modeling capability. Examples of these activities at a semiconductor equipment manufacturer will be given, with specifics of significant and useful results. Examples include the development and optimization of an inductive plasma source, trend analysis and hardware effects on ion energy distributions, and mass spectrometry influences on process development. Discussion will focus on plasma diagnostics for in-house development and proliferation in an environment with strong financial justification requirements.
advanced semiconductor manufacturing conference | 1999
P. Koch; Yan Ye; Diana Ma; Allen Zhao; Peter Hsieh; Chun Mu; Jenn Chow; S. Sherman
Recent development efforts in copper etch processing show promising results in many areas that have posed significant challenges for this new technology. We report on the etch performance for features down to 0.25 /spl mu/m with aspect ratios greater than 2:1. Copper etch rates of over 5000 /spl Aring//min have been achieved, and corrosion-free post copper etch performance has been demonstrated for periods in excess of two weeks. Electrical and device yield tests were conducted and presented in detail.
international interconnect technology conference | 1998
Yan Ye; Diana Ma; Allen Zhao; Peter Hsieh; Wayne Tu; Xiancan Deng; Gary Chu; Chun Mu; Jenn Chow; Peter K. Moon; Steta Sherman
Recent development efforts in copper etch processing show promising results in many areas that have posed significant challenges for this new technology. We report on etch performance for features down to 0.25 /spl mu/m with aspect ratios greater than 2:1. Copper etch rates greater than 5000 /spl square//min have been achieved, and corrosion-free post Cu etch performance has been demonstrated for periods in excess of 72 hours. Electrical tests were conducted and are presented in detail.
Archive | 1998
Yan Ye; Pavel Ionov; Allen Zhao; Peter Hsieh; Diana Xiaobing Ma; Chun Yan; Jie Yuan
Archive | 1997
Gerald Zheyao Yin; Diana Xiaobing Ma; Peter K. Loewenhardt; Philip M. Salzman; Allen Zhao; Hiroji Hanawa
Archive | 1999
Danny Lu; Allen Zhao; Peter Hsieh; Hong Shih; Li Xu; Yan Ye
Archive | 2001
Mehul Naik; Tim Weidman; Dian Sugiarto; Allen Zhao
Archive | 1997
Yan Ye; Allen Zhao; Peter Hsieh; Diana Xiaobing Ma
Archive | 2000
Yan Ye; Pavel Ionov; Allen Zhao; Peter Hsieh; Diana Xiaobing Ma; Chun Yan; Jie Yuan
Archive | 2000
Yan Ye; Pavel Ionov; Allen Zhao; Peter Hsieh; Diana Ma; Chun Yan; Jie Yuan