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Anthony L. Coyle

Texas Instruments

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Publication

Featured researches published by Anthony L. Coyle.

Archive | 2002

Method of fabricating a molded package for micromechanical devices

Anthony L. Coyle; George A. Bednarz

Archive | 2001

Plastic package for micromechanical devices

Anthony L. Coyle

Archive | 1997

Chip size integrated circuit package

Chee Kiang Yew; Yong Khim Swee; Min Yu Chan; Pang Hup Ong; Anthony L. Coyle

Archive | 2001

Molded package for micromechanical devices and method of fabrication

Anthony L. Coyle; George A. Bednarz

Archive | 2006

Non-pull back pad package with an additional solder standoff

Bernhard P. Lange; Anthony L. Coyle; Jeffrey Gail Holloway

Archive | 2006

Flip chip package with advanced electrical and thermal properties for high current designs

Bernhard P. Lange; Anthony L. Coyle

Archive | 2005

Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices

Bernhard P. Lange; Anthony L. Coyle; Quang X. Mai

Archive | 2004

Wafer-level assembly method for chip-size devices having flipped chips

William David Boyd; Chris Haga; Anthony L. Coyle; Leland S. Swanson; Quang Mai

Archive | 2006

STRESS-IMPROVED FLIP-CHIP SEMICONDUCTOR DEVICE HAVING HALF-ETCHED LEADFRAME

Anthony L. Coyle; Jie-Hua Zhao

Archive | 2007

Integrated circuit chip packaging assembly

Steven Kummerl; Anthony L. Coyle; Bernhard P. Lange

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Bernhard P. Lange

Texas Instruments

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Chris Haga

Texas Instruments

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William David Boyd

Texas Instruments

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Jeffrey Gail Holloway

Texas Instruments

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Leland S. Swanson

Texas Instruments

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George A. Bednarz

Texas Instruments

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Quang X. Mai

Texas Instruments

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Stefan Wlodzimierz Wiktor

Texas Instruments

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Steven Kummerl

Texas Instruments

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Vladimir Alexander Muratov

Texas Instruments

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