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Jeffrey Gail Holloway

Texas Instruments

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Publication

Featured researches published by Jeffrey Gail Holloway.

Archive | 2006

Non-pull back pad package with an additional solder standoff

Bernhard P. Lange; Anthony L. Coyle; Jeffrey Gail Holloway

Archive | 2009

CHIP ON LEAD WITH SMALL POWER PAD DESIGN

M. Todd Wyant; Jeffrey Gail Holloway; Anthony L. Coyle

Archive | 2005

Reduced foot print lead-less package with tolerance for thermal and mechanical stresses and method thereof

Jeffrey Gail Holloway; Sreenivasan K. Koduri

Archive | 2011

METHODS AND DEVICES FOR MANUFACTURING CANTILEVER LEADS IN A SEMICONDUCTOR PACKAGE

Jeffrey Gail Holloway

Archive | 2007

Design and Method for Attaching a Die to a Leadframe in a Semiconductor Device

Jeffrey Gail Holloway; Steven Kummerl; Bernhard P. Lange

Archive | 2006

Semiconductor dies and methods and apparatus to mold lock a semiconductor die

Steven Kummerl; Bernhard P. Lange; Jeffrey Gail Holloway

Archive | 2007

PLASTIC SEMICONDUCTOR PACKAGES HAVING IMPROVED METAL LAND-LOCKING FEATURES

Jeffrey Gail Holloway; Steven Kummerl

Archive | 2006

Integrated Circuits Having Controlled Inductances

Anthony L. Coyle; Reynaldo Corpuz Javier; Jeffrey Gail Holloway

Archive | 2012

Semiconductor Package with Cantilever Leads

Jeffrey Gail Holloway

Archive | 2007

Puces de semi-conducteur et procédés et appareil de verrouillage d'une puce de semi-conducteur

Steven Kummerl; Bernhard P. Lange; Jeffrey Gail Holloway

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Bernhard P. Lange

Texas Instruments

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Steven Kummerl

Texas Instruments

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Anthony L. Coyle

Texas Instruments

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M. Todd Wyant

Texas Instruments

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Reynaldo Corpuz Javier

Texas Instruments

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