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Bernhard P. Lange

Texas Instruments

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Publication

Featured researches published by Bernhard P. Lange.

Archive | 2007

Bond capillary design for ribbon wire bonding

Bernhard P. Lange; Steven Alfred Kummeri

Archive | 2006

Non-pull back pad package with an additional solder standoff

Bernhard P. Lange; Anthony L. Coyle; Jeffrey Gail Holloway

Archive | 2006

Flip chip package with advanced electrical and thermal properties for high current designs

Bernhard P. Lange; Anthony L. Coyle

Archive | 2006

Mold compound interlocking feature to improve semiconductor package strength

Bernhard P. Lange

Archive | 2005

Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices

Bernhard P. Lange; Anthony L. Coyle; Quang X. Mai

Archive | 2007

LEADFRAME AND MOLD COMPOUND INTERLOCK IN PACKAGED SEMICONDUCTOR DEVICE

Bernhard P. Lange; Steven Kummerl

Archive | 2006

Mold cavity identification markings for IC packages

Bernhard P. Lange

Archive | 2007

Integrated circuit chip packaging assembly

Steven Kummerl; Anthony L. Coyle; Bernhard P. Lange

Archive | 2006

Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packages

Bernhard P. Lange

Archive | 2008

Semiconductor assembly and packaging for high current and low inductance

Bernhard P. Lange

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Collaboration

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Steven Kummerl

Texas Instruments

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Anthony L. Coyle

Texas Instruments

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Jeffrey Gail Holloway

Texas Instruments

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Johann Gross

Texas Instruments

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Thies Puchert

Texas Instruments

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Quang X. Mai

Texas Instruments

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Stefan Wlodzimierz Wiktor

Texas Instruments

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Vladimir Alexander Muratov

Texas Instruments

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Jürgen Neuhäusler

Texas Instruments

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Steven Alfred Kummeri

Texas Instruments

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