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Arnold I. Baise

IBM

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Publication

Featured researches published by Arnold I. Baise.

Archive | 1990

Low dielectric composite substrate

John Acocella; Arnold I. Baise; Richard A. Bates; Jon A. Casey; David R. Clarke; Renuka Shastri Divakaruni; James N. Humenik; Steven M. Kandetzke; Daniel Patrick Kirby; John U. Knickerbocker; Sarah H. Knickerbocker; Amy T. Matts; Robert Wolff Nufer; Srinivasa S. N. Reddy; Mark Anthony Takacs; Lovell B. Wiggins

Archive | 1992

Process for fabricating a low dielectric composite substrate

John Acocella; Peter A. Agostino; Arnold I. Baise; Richard A. Bates; Ray Bryant; Jon A. Casey; David R. Clarke; George Czornyj; Allen J. Dam; Lawrence Daniel David; Renuka Shastri Divakaruni; Werner Ernest Dunkel; Ajay P. Giri; Liang-Choo Hsia; James N. Humenik; Steven M. Kandetzke; Daniel Patrick Kirby; John U. Knickerbocker; Sarah H. Knickerbocker; Anthony Mastreani; Amy T. Matts; Robert Wolff Nufer; Charles Hampton Perry; Srinivasa S. N. Reddy; Salvatore James Scilla; Mark Anthony Takacs; Lovell B. Wiggins

Archive | 1981

Acetylene terminated, branched polyphenylene resist and protective coating for integrated circuit devices

Arnold I. Baise; George Czornyj; Anthony Wai Wu

Archive | 1983

Biphenylene end-capped quinoxaline polymers and their use as insulating coatings for semiconductor devices

Arnold I. Baise; Anthony Wai Wu

Archive | 1982

Process for forming a protective coating on integrated circuit devices

Arnold I. Baise; George Czornyj; Anthony Wai Wu

Archive | 1981

Process for adhering an organic resin to a substrate by means of plasma polymerized phosphines

Arnold I. Baise; John Martin Burns; Harbans S. Sachdev

Archive | 1982

Method for producing coatings of organic resins on substrates

Arnold I. Baise; John Martin Burns; Harbans S. Sachdev

Archive | 1989

Composite substrate with low dielectric constant.

Arnold I. Baise; Jon A. Casey; David R. Clarke; Renuka Shastri Divakaruni; Werner Ernest Dunkel; James N. Humenik; Steven M. Kandetzke; Daniel Patrick Kirby; John U. Knickerbocker; Amy T. Matts; Mark Anthony Takacs; Lovell B. Wiggins

Archive | 1983

Chinoxalin-polymere mit biphenylen-endgruppen und ihre verwendung als isolierueberzuege in halbleiterelementen. Quinoxaline-biphenylene-terminated polymers and their use as insulating coatings in semiconductor elements.

Arnold I. Baise; Anthony Wai Wu

Archive | 1982

Plasma polymerized phosphines as adhesion promoters

Arnold I. Baise; John Martin Burns; Harbans S. Sachdev

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Collaboration

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Anthony Wai Wu

IBM

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Harbans S. Sachdev

IBM

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John Martin Burns

IBM

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Amy T. Matts

IBM

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Daniel Patrick Kirby

IBM

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George Czornyj

IBM

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James N. Humenik

IBM

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John U. Knickerbocker

IBM

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Jon A. Casey

IBM

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Lovell B. Wiggins

IBM

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