Arwa T. Kutbee

Mechanical anomaly impact on metal-oxide-semiconductor capacitors on flexible silicon fabric

We report the impact of mechanical anomaly on high-κ/metal-oxide-semiconductor capacitors built on flexible silicon (100) fabric. The mechanical tests include studying the effect of bending radius up to 5 mm minimum bending radius with respect to breakdown voltage and leakage current of the devices. We also report the effect of continuous mechanical stress on the breakdown voltage over extended periods of times.

Nonplanar Nanoscale Fin Field Effect Transistors on Textile, Paper, Wood, Stone, and Vinyl via Soft Material-Enabled Double-Transfer Printing.

The ability to incorporate rigid but high-performance nanoscale nonplanar complementary metal-oxide semiconductor (CMOS) electronics with curvilinear, irregular, or asymmetric shapes and surfaces is an arduous but timely challenge in enabling the production of wearable electronics with an in situ information-processing ability in the digital world. Therefore, we are demonstrating a soft-material enabled double-transfer-based process to integrate flexible, silicon-based, nanoscale, nonplanar, fin-shaped field effect transistors (FinFETs) and planar metal-oxide-semiconductor field effect transistors (MOSFETs) on various asymmetric surfaces to study their compatibility and enhanced applicability in various emerging fields. FinFET devices feature sub-20 nm dimensions and state-of-the-art, high-κ/metal gate stacks, showing no performance alteration after the transfer process. A further analysis of the transferred MOSFET devices, featuring 1 μm gate length, exhibits an ION value of nearly 70 μA/μm (VDS = 2 V, VGS = 2 V) and a low subthreshold swing of around 90 mV/dec, proving that a soft interfacial material can act both as a strong adhesion/interposing layer between devices and final substrate as well as a means to reduce strain, which ultimately helps maintain the devices performance with insignificant deterioration even at a high bending state.

Free-Form Flexible Lithium-Ion Microbattery

Wearable electronics need miniaturized, safe, and flexible power sources. Lithium-ion battery is a strong candidate as high performance flexible battery. The development of flexible materials for battery electrodes suffers from the limited material choices. In this paper, we present integration strategy to rationally design materials and processes to report flexible inorganic lithium-ion microbattery with no restrictions on the materials used. The battery shows an enhanced normalized capacity of 147 μAh/cm2 when bent.

Flexible and biocompatible high-performance solid-state micro-battery for implantable orthodontic system

To augment the quality of our life, fully compliant personalized advanced health-care electronic system is pivotal. One of the major requirements to implement such systems is a physically flexible high-performance biocompatible energy storage (battery). However, the status-quo options do not match all of these attributes simultaneously and we also lack in an effective integration strategy to integrate them in complex architecture such as orthodontic domain in human body. Here we show, a physically complaint lithium-ion micro-battery (236 μg) with an unprecedented volumetric energy (the ratio of energy to device geometrical size) of 200 mWh/cm3 after 120 cycles of continuous operation. Our results of 90% viability test confirmed the battery’s biocompatibility. We also show seamless integration of the developed battery in an optoelectronic system embedded in a three-dimensional printed smart dental brace. We foresee the resultant orthodontic system as a personalized advanced health-care application, which could serve in faster bone regeneration and enhanced enamel health-care protection and subsequently reducing the overall health-care cost.Bioelectronics: A flexible micro-battery for healthcareThere is an increasing demand for advanced healthcare electronics. That can be powered by physically flexible, biocompatible and high performance energy storage devices. However, existing technologies do not allow a combination of all favorable attributes in a single system. Now Muhammad Hussain and co-workers from King Abdullah University of Science and Technology in Saudi Arabia show a physically compliant lithium ion micro-battery with an unprecedented high volumetric energy after cycling 120 times. They further integrate the battery module in a 3D printed encapsulation with near-infrared LEDs to demonstrate a smart dental brace. The present orthodontic system may be used as a personalized healthcare device that serves in faster bone regeneration and enhanced enamel healthcare protection with cost benefits.

Water soluble nano-scale transient material germanium oxide for zero toxic waste based environmentally benign nano-manufacturing

In the recent past, with the advent of transient electronics for mostly implantable and secured electronic applications, the whole field effect transistor structure has been dissolved in a variety of chemicals. Here, we show simple water soluble nano-scale (sub-10 nm) germanium oxide (GeO2) as the dissolvable component to remove the functional structures of metal oxide semiconductor devices and then reuse the expensive germanium substrate again for functional device fabrication. This way, in addition to transiency, we also show an environmentally friendly manufacturing process for a complementary metal oxide semiconductor (CMOS) technology. Every year, trillions of complementary metal oxide semiconductor (CMOS) electronics are manufactured and billions are disposed, which extend the harmful impact to our environment. Therefore, this is a key study to show a pragmatic approach for water soluble high performance electronics for environmentally friendly manufacturing and bioresorbable electronic applications.

Flexible lithium-ion planer thin-film battery

Commercialization of wearable electronics requires miniaturized, flexible power sources. Lithium ion battery is a strong candidate as the next generation high performance flexible battery. The development of flexible materials for battery electrodes suffers from the limited material choices. In this work, we present a flexible inorganic lithium-ion battery with no restrictions on the materials used. The battery showed an enhanced normalized capacity of 146 μAh/cm2.

CMOS compatible generic batch process towards flexible memory on bulk monocrystalline silicon (100)

Todays mainstream flexible electronics research is geared towards replacing silicon either totally, by having organic devices on organic substrates, or partially, by transferring inorganic devices onto organic substrates. In this work, we present a pragmatic approach combining the desired flexibility of organic substrates and the ultra-high integration density, inherent in silicon semiconductor industry, to transform bulk/inflexible silicon into an ultra-thin mono-crystalline fabric. We also show the effectiveness of this approach in achieving fully flexible electronic systems. Furthermore, we provide a progress report on fabricating various memory devices on flexible silicon fabric and insights for completely flexible memory modules on silicon fabric.

Transformational electronics: a powerful way to revolutionize our information world

With the emergence of cloud computation, we are facing the rising waves of big data. It is our time to leverage such opportunity by increasing data usage both by man and machine. We need ultra-mobile computation with high data processing speed, ultra-large memory, energy efficiency and multi-functionality. Additionally, we have to deploy energy-efficient multi-functional 3D ICs for robust cyber-physical system establishment. To achieve such lofty goals we have to mimic human brain, which is inarguably the world’s most powerful and energy efficient computer. Brain’s cortex has folded architecture to increase surface area in an ultra-compact space to contain its neuron and synapses. Therefore, it is imperative to overcome two integration challenges: (i) finding out a low-cost 3D IC fabrication process and (ii) foldable substrates creation with ultra-large-scale-integration of high performance energy efficient electronics. Hence, we show a low-cost generic batch process based on trench-protect-peel-recycle to fabricate rigid and flexible 3D ICs as well as high performance flexible electronics. As of today we have made every single component to make a fully flexible computer including non-planar state-of-the-art FinFETs. Additionally we have demonstrated various solid-state memory, movable MEMS devices, energy harvesting and storage components. To show the versatility of our process, we have extended our process towards other inorganic semiconductor substrates such as silicon germanium and III-V materials. Finally, we report first ever fully flexible programmable silicon based microprocessor towards foldable brain computation and wirelessly programmable stretchable and flexible thermal patch for pain management for smart bionics.

Wavy Architecture Thin‐Film Transistor for Ultrahigh Resolution Flexible Displays

A novel wavy-shaped thin-film-transistor (TFT) architecture, capable of achieving 70% higher drive current per unit chip area when compared with planar conventional TFT architectures, is reported for flexible display application. The transistor, due to its atypical architecture, does not alter the turn-on voltage or the OFF current values, leading to higher performance without compromising static power consumption. The concept behind this architecture is expanding the transistors width vertically through grooved trenches in a structural layer deposited on a flexible substrate. Operation of zinc oxide (ZnO)-based TFTs is shown down to a bending radius of 5 mm with no degradation in the electrical performance or cracks in the gate stack. Finally, flexible low-power LEDs driven by the respective currents of the novel wavy, and conventional coplanar architectures are demonstrated, where the novel architecture is able to drive the LED at 2 × the output power, 3 versus 1.5 mW, which demonstrates the potential use for ultrahigh resolution displays in an area efficient manner.

Democratized electronics to enable smart living for all

With the increased global population, smart living is an increasingly important criteria to ensure equal opportunities for all. Therefore, what is Smart Living? The first time when we tossed this terminology seven years back, we thought reducing complexities in human life. Today we believe it more. However, smart living for all complicates the technological need further. As by all, we mean any age group, any academic background and any financial condition. Although electronics are powerful today and have enabled our digital world, many as of today have not experienced that progress. Going forward while we realize more and more electronics in our daily life, the most important question would be how. Here we show, a heterogeneous integration approach to integrate low-cost high performance interactive electronic system which are physically compliant. We are redesigning electronics to redefine its purposes to reconfigure life for all to enable smart living.