Benedite Osternaud

Recycling a wafer comprising a buffer layer, after having taken off a thin layer therefrom

Recycling a wafer comprising a buffer layer, after having separated a thin layer therefrom

Methods for transferring a thin layer from a wafer having a buffer layer

Mechanical recycling of a wafer comprising a buffer layer, after having taken a layer therefrom

Recycling of a wafer comprising a buffer layer after having separated a thin layer therefrom by mechanical means

Method and apparatus for adjusting the thickness of a thin layer of semiconductor material

Recycling donor wafer after having taken off useful layer of semiconductor materials, involves removing substance to remain part of multi-layer structure without supplementary step of reforming the useful layer

Recycling donor wafer after having taken at least one useful layer of material chosen from semiconductor materials, comprises removal of substance on side of donor wafer where taking-off took place by employing mechanical means

A METHOD OF PREPARING A THIN LAYER, THE METHOD INCLUDING A STEP OF CORRECTING THICKNESS BY SACRIFICIAL OXIDATION, AND AN ASSOCIATED MACHINE

A method of preparing a thin layer of semiconductor material