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Benedite Osternaud

Soitec

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Publication

Featured researches published by Benedite Osternaud.

Archive | 2003

Recycling a wafer comprising a buffer layer, after having taken off a thin layer therefrom

Bruno Ghyselen; Cecile Aulnette; Benedite Osternaud; Vaillant Yves Mathieu Le; Takeshi Akatsu

Archive | 2004

Recycling a wafer comprising a buffer layer, after having separated a thin layer therefrom

Bruno Ghyselen; Cecile Aulnette; Benedite Osternaud; Yves-Mathieu Vaillant; Takeshi Akatsu

Archive | 2005

Methods for transferring a thin layer from a wafer having a buffer layer

Bruno Ghyselen; Cecile Aulnette; Benedite Osternaud; Nicolas Daval

Archive | 2003

Mechanical recycling of a wafer comprising a buffer layer, after having taken a layer therefrom

Bruno Ghyselen; Cecile Aulnette; Benedite Osternaud; Vaillant Yves Mathieu Le; Takeshi Akatsu

Archive | 2003

Recycling of a wafer comprising a buffer layer after having separated a thin layer therefrom by mechanical means

Bruno Ghyselen; Cecile Aulnette; Benedite Osternaud; Yves-Mathieu Vaillant; Takeshi Akatsu

Archive | 2003

Method and apparatus for adjusting the thickness of a thin layer of semiconductor material

Bruno Ghyselen; Cecile Aulnette; Benedite Osternaud

Archive | 2003

Recycling donor wafer after having taken off useful layer of semiconductor materials, involves removing substance to remain part of multi-layer structure without supplementary step of reforming the useful layer

Bruno Ghysclen; Cecile Aulnette; Benedite Osternaud

Archive | 2002

Recycling donor wafer after having taken at least one useful layer of material chosen from semiconductor materials, comprises removal of substance on side of donor wafer where taking-off took place by employing mechanical means

Bruno Ghyselen; Cecile Aulnette; Benedite Osternaud; Takeshi Akatsu; Yves Mathieu Levaillant

Archive | 2004

A METHOD OF PREPARING A THIN LAYER, THE METHOD INCLUDING A STEP OF CORRECTING THICKNESS BY SACRIFICIAL OXIDATION, AND AN ASSOCIATED MACHINE

Bruno Ghyselen; Cecile Aulnette; Benedite Osternaud

Archive | 2010

A method of preparing a thin layer of semiconductor material

Bruno Ghyselen; Cecile Aulnette; Benedite Osternaud

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Collaboration

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Cecile Aulnette

Soitec

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Bruno Ghyselen

Soitec

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Takeshi Akatsu

Soitec

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Vaillant Yves Mathieu Le

Soitec

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Nicolas Daval

Soitec

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Nicolas Daval

Soitec

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