Benny Lai
Hewlett-Packard
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Publication
Featured researches published by Benny Lai.
international solid-state circuits conference | 1992
Richard C. Walker; Jieh-Tsorng Wu; Cheryl Stout; Benny Lai; Chu-Sun Yen; Tom Hornak; Patrick Petruno
The authors report a monolithic transmitter and receiver chip pair which implements a full-duplex virtual ribbon cable interface. For short-distance applications, on-chip equalizer is provided to allow use of coaxial cables rather than a more costly fiber link. The chips require no external frequency-determining elements or user adjustments and operate over a range of 600 to 1500 MHz using an on-chip VCO (voltage-controlled oscillator). Only one in-package capacitor per chip is required. A state-machine controller (SMC) is also implemented on the RX chip to transparently handle a start-up handshake protocol. This is the highest-speed-link-interface chipset reported to date at this level of functionality and integration.<<ETX>>
european microwave conference | 1992
Benny Lai; Richard C. Walker; Cheryl Stout; Jieh Tsorng Wu
A 1.5 GBaud/s serial data link comprised of a 2-chip set capable of transporting up to 21 parallel bits was successfully fabricated using a 25 GHz peak ft silicon bipolar process. This link features a new encoding scheme which allows DC balance in the serial stream, as well as an internally generated clock which phase locks to the users clock at the transmitter, and full clock recovery and data retiming at the receiver. In addition, a controller integrated with the link handles handshaking at start up for full duplex operation.
global communications conference | 1992
Chu-Sun Yen; Richard C. Walker; Cheryl Stout; Benny Lai; J. Win
A chipset has been developed for transmitting parallel data over serial links. The chipset, consisting of a transmitter interface chip (TIC) and a receiver interface chip (RIC), can support serial transmission up to 1.4 Gbaud. Data encoding is based on a scheme published earlier, but has been improved to provide more flexibility and better efficiency. The chipset requires no external components for its operation other than a few capacitors, which are built into its custom package.<<ETX>>
IEEE Journal of Solid-state Circuits | 1992
Richard C. Walker; Cheryl Stout; Jieh-Tsorng Wu; Benny Lai; Chu-Sun Yen; Tom Hornak; Patrick Petruno
Archive | 1991
Thomas Hornak; Patrick Petruno; Richard C. Walker; Benny Lai; Chu-Sun Yen; Cheryl Stout; Jieh-Tsorng Wu
Archive | 1993
Donald M. Lee; Benny Lai
Archive | 1989
Benny Lai; Richard C. Walker
Archive | 1996
Benny Lai
Archive | 1994
Benny Lai; Richard C. Walker
Archive | 1995
Benny Lai