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Bernd Scheibe

Infineon Technologies

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Publication

Featured researches published by Bernd Scheibe.

Archive | 2007

Method for manufacturing a flip-chip package, substrate for manufacturing and flip-chip assembly

Martin Reiss; Bernd Scheibe; Stephan Blaszczak

Archive | 2006

Adhesion tape and method for mounting a chip onto a substrate

Martin Reiss; Bernd Scheibe; Stephan Blaszczak

Archive | 2004

Substrate-based package for integrated circuits

Stephan Blaszczak; Martin Reiss; Bernd Scheibe

Archive | 2003

Chip substrate for producing a chip package to be constructed on the substrate has a bond between substrate and chip extending almost completely across a chip side

Carsten Bender; Stephan Blaszczak; Kerstin Nocke; Martin Reiss; Bernd Scheibe

Archive | 2003

Substrate for making solder connection to second substrate or chip has solder pad with solderable adhesive surfaces in addition to electrical contact surface

Stephan Blaszczak; Martin Reiss; Bernd Scheibe

Archive | 2006

METHOD OF MANUFACTURING ELECTRONIC COMPONENT ASSEMBLY AND CORRESPONDING ELECTRONIC COMPONENT ASSEMBLY

Blaszczak Stephan; Hedler Harry; Knut Kahlisch; Kroehnert Steffen; Soo Gil Park; Martin Reiss; Ingolf Rau; Bernd Scheibe

Archive | 2005

Substrate-based integrated circuit package

Stephan Blaszczak; Martin Reiss; Bernd Scheibe

Archive | 2005

Method for fabricating an integrated module, requires housing material for functioning together holding structure in substrate

Stephan Blaszczak; Sebastian Müller; Kerstin Nocke; Martin Reiss; Bernd Scheibe

Archive | 2005

Method for producing an adhesive bond and adhesive bond between a chip and a planar surface

Stephan Blaszczak; Martin Reiss; Bernd Scheibe

Archive | 2005

Manufacturing method for an electronic component assembly and corresponding electronic component assembly

Stephan Blaszczak; Martin Reiss; Bernd Scheibe; Steffen Kroehnert; Knut Kahlisch; Ingolf Rau; Harry Hedler; Soo Gil Park

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Martin Reiss

Infineon Technologies

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Stephan Blaszczak

Infineon Technologies

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Kerstin Nocke

Infineon Technologies

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Carsten Bender

Infineon Technologies

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Knut Kahlisch

Infineon Technologies

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Sebastian Müller

Infineon Technologies

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Soo Gil Park

Siemens

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Harry Hedler

Qimonda

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Steffen Kroehnert

Infineon Technologies

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