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Carsten Bender

Infineon Technologies

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Publication

Featured researches published by Carsten Bender.

Archive | 2004

Substrate for producing a soldering connection

Martin Reiss; Carsten Bender; Kerstin Nocke

Archive | 2005

Arrangement for increasing the reliability of substrate-based BGA packages

Martin Reiss; Anton Legen; Manuel Dr. Carmona; Carsten Bender

Archive | 2005

Board on chip package for high frequency integrated circuit, has silicon chip with core including copper wires having build-up layers, which are structured, such that copper wires on substrate is directly accessible in canal for wire bonds

Carsten Bender; Minka Gospodinova; Jürgen Dr.-Ing. Grafe; Dominique Savignac; Jochen Thomas; Ingo Wennemuth

Archive | 2003

Appliance for improving reliability of BGA (ball grid array) solder connections between BGA component substrate, whose contact pads are fitted with solder balls or bumps

Carsten Bender; Kerstin Nocke; Martin Dr. rer.nat. Reiß

Archive | 2003

Chip substrate for producing a chip package to be constructed on the substrate has a bond between substrate and chip extending almost completely across a chip side

Carsten Bender; Stephan Blaszczak; Kerstin Nocke; Martin Reiss; Bernd Scheibe

Archive | 2006

Substratbasiertes Die-Package mit BGA- oder BGA-ähnlichen Komponenten

Carsten Bender; Manuel Dr. Carmona; Steffen Kroehnert; Anton Legen; Martin Reiss

Archive | 2006

Method for producing an FBGA component and substrate for carrying out the method

Steffen Kroehnert; Knut Kahlisch; Ruediger Uhlmann; Carsten Bender

Archive | 2006

Substrate for a substrate-based electronic component and electronic component with improved reliability

Carsten Bender; Oliver Grassme; Kerstin Nocke; Soo Gil Park; Frank Pfeiffer; Martin Reiss

Archive | 2005

Anordnung zur Verbesserung der Modulzuverlässigkeit

Martin Reiss; Kerstin Nocke; Carsten Bender

Archive | 2005

Fine ball grid array component manufacturing method, involves pressing grouting form for detection of lower housing part on solder ball side, and designing substrate surface as sealing area such that surface is provided with sealing units

Carsten Bender; Knut Kahlisch; Steffen Kroehnert; Rudiger Uhlmann

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Collaboration

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Martin Reiss

Infineon Technologies

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Kerstin Nocke

Infineon Technologies

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Steffen Kroehnert

Infineon Technologies

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Anton Legen

Infineon Technologies

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Manuel Dr. Carmona

Infineon Technologies

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Bernd Scheibe

Infineon Technologies

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Dominique Savignac

Infineon Technologies

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Ingo Wennemuth

Infineon Technologies

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Jochen Thomas

Infineon Technologies

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Jürgen Dr.-Ing. Grafe

Infineon Technologies

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