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Burton J. Carpenter

Freescale Semiconductor

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Publication

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Archive | 2008

Varied Solder Mask Opening Diameters Within a Ball Grid Array Substrate

Burton J. Carpenter; Patrice L. Langford; Wayne S. Lindsay; Boon Yew Low

Archive | 2006

Integrated circuit having pads and input/output (I/O) cells

Nhat D. Vo; Tu-Anh Tran; Burton J. Carpenter; Dae Y. Hong; James W. Miller; Kendall D. Phillips

Archive | 2012

INTEGRATED CIRCUIT DIE ASSEMBLY WITH HEAT SPREADER

Burton J. Carpenter; Leo M. Higgins

Archive | 2016

Aluminum clad copper structure of an electronic component package and a method of making an electronic component package with an aluminum clad copper structure

Burton J. Carpenter; Chu-Chung Lee; Tu-Anh N. Tran

Archive | 2012

Method for forming die assembly with heat spreader

Leo M. Higgins; Burton J. Carpenter; Glenn G. Daves

Archive | 2013

Method for forming a semiconductor device assembly having a heat spreader

Leo M. Higgins; Burton J. Carpenter

Archive | 2014

TIN-BASED WIREBOND STRUCTURES

Burton J. Carpenter; Leo M. Higgins; Varughese Mathew; Tu-Anh N. Tran; Nhat D. Vo

Archive | 2015

ALUMINUM CLAD COPPER STRUCTURE OF AN ELECTRONIC COMPONENT PACKAGE

Burton J. Carpenter; Chu-Chung Lee; Tu-Anh N. Tran

Archive | 2013

Semiconductor devices with multilayer flex interconnect structures

Burton J. Carpenter; Twila J. Eichman

Archive | 2012

Thermally Enhanced Electronic Component Packages with Through Mold Vias

Burton J. Carpenter; Nhat D. Vo

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Collaboration

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Leo M. Higgins

Freescale Semiconductor

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Tu-Anh N. Tran

Freescale Semiconductor

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Chu-Chung Lee

Freescale Semiconductor

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Nhat D. Vo

Freescale Semiconductor

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Yuan Yuan

Freescale Semiconductor

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Dae Y. Hong

Freescale Semiconductor

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Derek S. Swanson

Freescale Semiconductor

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Glenn G. Daves

Freescale Semiconductor

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James W. Miller

Freescale Semiconductor

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Kendall D. Phillips

Freescale Semiconductor

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