Glenn G. Daves

Test and Burn-in Sockets

This chapter addresses the use of area-array socket technology during test and burn-in at the module level. Single chip and multichip modules (SCM, MCM) and their corresponding socket form factors are described ranging from small chip scale packages (CSP) having micro ball grid arrays (MBGA) to very large land grid arrays (LGA) having in excess of 5000 I/Os [1]. Module sizes correspondingly range from tens of millimeters to over one hundred millimeters. Module frequencies of operation range from typical values of approximately 60 MHz for low-end digital applications to multi-gigahertz rf applications. Operating frequency is a primary socket design factor since it has a significant influence on the module contacting method.