Cengiz A. Palanduz

Capacitor having an anodic metal oxide substrate

Delivery regions for power, ground and I/O signal paths in an IC package

Method of forming a thin film capacitor

Thin film capacitors and methods of making the same

Ceramic package substrate with recessed device

Piezo actuator for cooling

Forming a substrate core with embedded capacitor and structures formed thereby

Array capacitors in interposers, and methods of using same

Integrated circuit package substrate having a thin film capacitor structure

Metal oxide ceramic thin film on base metal electrode