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Latest external collaboration on country level. Dive into details by clicking on the dots.

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Dive into the research topics where Chandrika Prasad is active.

Publication


Featured researches published by Chandrika Prasad.


Archive | 2002

Chip and wafer integration process using vertical connections

H. Bernhard Pogge; Roy Yu; Chandrika Prasad; Chandrasekhar Narayan


Archive | 2003

Method of fabricating integrated electronic chip with an interconnect device

H. Bernhard Pogge; Chandrika Prasad; Roy Yu


Archive | 1993

Interconnect structure having improved metallization

Umar M. Ahmad; Ananda Hosakere Kumar; Eric D. Perfecto; Chandrika Prasad; Sampath Purushothaman; Sudipta K. Ray


Archive | 2002

Three-dimensional integrated CMOS-MEMS device and process for making the same

H. Bernhard Pogge; Michel Despont; Ute Drechsler; Chandrika Prasad; Peter Vettiger; Roy Yu


Archive | 1995

Method for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packages and the resulting MLTF structure

Michael McAllister; James E. McDonald; Eric D. Perfecto; Chandrika Prasad; Keshav Prasad; Gordon Jay Robbins; Madhavan Swaminathan; George White


Archive | 1995

Method of making area direct transfer multilayer thin film structure

Eric D. Perfecto; Chandrika Prasad; George White; Kwong Hon Wong


Archive | 2002

Process for making fine pitch connections between devices and structure made by the process

H. Bernhard Pogge; Chandrika Prasad; Roy Yu


Archive | 1998

Multi-level thin-film electronic packaging structure and related method

Chandrika Prasad; Roy Yu; Richard L. Canull; Giulio DiGiacomo; Ajay P. Giri; Lewis S. Goldmann; Kimberley A. Kelly; Bouwe W. Leenstra; Voya R. Markovich; Eric D. Perfecto; Sampath Purushothaman; Joseph M. Sullivan


Archive | 2000

Method and structure to prevent distortion and expansion of organic spacer layer for thin film transfer-join technology

Suryanarayana Kaja; Chandrika Prasad; RongQing Yu


Archive | 1982

Process for controlled braze joining of electronic packaging elements

William Robert Miller; Chandrika Prasad

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