Bouwe W. Leenstra | Researchain

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Featured researches published by Bouwe W. Leenstra.

Archive | 1998

Multi-level thin-film electronic packaging structure and related method

Chandrika Prasad; Roy Yu; Richard L. Canull; Giulio DiGiacomo; Ajay P. Giri; Lewis S. Goldmann; Kimberley A. Kelly; Bouwe W. Leenstra; Voya R. Markovich; Eric D. Perfecto; Sampath Purushothaman; Joseph M. Sullivan

Archive | 2001

Process for forming a multi-level thin-film electronic packaging structure

Archive | 1995

Apparatus for providing solder interconnections to semiconductor and electronic packaging devices

William Brearley; Laertis Economikos; Paul F. Findeis; Kimberley A. Kelly; Bouwe W. Leenstra; Arthur G. Merryman; Eric D. Perfecto; Chandrika Prasad; James Wood; Roy Yu

Archive | 1998

Apparatus and method for use in manufacturing semiconductor devices

William Brearley; Laertis Economikos; Paul F. Findeis; Kimberley A. Kelly; Bouwe W. Leenstra; Arthur G. Merryman; Eric D. Perfecto; Chandrika Prasad; James Wood; Roy Yu

Archive | 1996

Bottom-surface-metallurgy rework process in ceramic modules

Roy Yu; James Wood; Thomas Michael Biruk; Gregory S. Boettcher; William Brearley; Kimberley Ann Kelly; Bouwe W. Leenstra; Arthur G. Merryman

Archive | 1997

Laser ablation top surface reference chuck

Ralph R. Comulada; Bouwe W. Leenstra; Christopher L. Tessler

Archive | 2013

Fill head interface with combination vacuum pressure chamber

Glen N. Biggs; Russell A. Budd; Benjamin V. Fasano; John J. Garant; Peter A. Gruber; John P. Karidis; Bouwe W. Leenstra; Phillip W. Palmatier; Kevin M. Prettyman; Christopher L. Tessler; Thomas Weiss

Archive | 2006

Pressure-only molten metal valving apparatus and method

Glen N. Biggs; John J. Garant; Peter A. Gruber; Bouwe W. Leenstra; Christopher L. Tessler; Thomas Weiss

Archive | 2010

VACUUM TRANSITION FOR SOLDER BUMP MOLD FILLING

Robert Haas; John J. Garant; Phil Palmatier; Bouwe W. Leenstra

Archive | 2014

Fill head apparatus

Glen N. Biggs; J Joseph Garant; Phillip W. Palmatier; Christopher L. Tessler; Thomas Weiss; John P. Karidis; Russell A. Budd; Bouwe W. Leenstra; Kevin M. Prettyman; Benjamin V. Fasano; Peter A. Gruber

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