Chang-Lin Wei

Embedded passives on multi-layer printed wiring board (PWB) for 5GHz front-end module

As wireless communication devices become smaller and lighter, less space is allowed for the placement of the RF components. Area reduction of circuit design is becoming more and more notable. This paper introduces the design and model for the basic embedded passives, and methods of circuits design with embedded elements for 5 GHz RF front-end module for IEEE 802.11a on PWB lamination process. The developed front-end module includes PA (power amplifier) and SPDT (single pole, double throw) switch. The power amplifier exhibits 25.5 dB of gain, 26 dBm of output P1dB, and output IP3 of 37.6 dBm. The SPDT switch shows 2 dB of insertion loss and 18dB of port return loss. Six layer stacks and three kinds of materials, such as Hi-DK material, low-loss material and commercial organic material were applied in this design. In this substrate, we use special high dielectric constant (DK >60 @ 1MHz) material to design embedded capacitors and use the embedded resistors (1k ohm/per square) for whole SiP module. The simulation and measured results have demonstrated a successful circuits design of RF front-end module for 802.11a WLAN

Embedded Wide-Band Filter on Rigid / Flex. Multilayer PCB for SiP

In this paper, a novel method to realize wide-band band-pass filter is presented. The filter is constructed by serial and shunt transmission-line sections and fabricated on multilayer PCB substrates. The frequency response is specified with a pass band of 1.8-5.8 GHz, and with less than 3 dB insertion losses and more than 10 dB return losses in the pass band. Good agreement between the measured and simulated results has been observed. In addition, the transformation models of flexible substrates are also studied by using the 3D electromagnetic simulator. It is shown that the deviations of frequency responses are less than 10% of the unfolded case. Thus, the filters structure is suitable for both rigid and flexible substrates

Embedded Passives On Multi-Layer Printed Circuit Board for 5GHz WLAN Power Amplifier

This paper introduces the design and model for the basic embedded passives, and methods of circuits design with embedded elements for IEEE 802.11a on PWB lamination process. The power amplifier exhibits 26.4 dB of gain, 26 dBm of output PldB, and output IP3 of 37.2 dBm. Six layer stacks and three kinds of materials, such as Hi-DK material, low-loss material and commercial organic material were applied in this design. In this substrate, we use special high dielectric constant (DK>60 @ 1MHz) material to design embedded capacitors and use the new embedded resistors (Ik ohm/per square) for whole SiP module. The simulation and measured results have demonstrated a successful circuit design for 802.11a WLAN.