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Huang Li-Hsien

TSMC

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Publication

Featured researches published by Huang Li-Hsien.

Archive | 2018

Chip package structure with bump and method for forming the same

Chen Wei-Yu; Huang Li-Hsien; Su An-Jhih; Chen Hsien-Wei

Archive | 2017

TEST KEY STRCUTURES, INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

Chen Shao-Yun; Chen Hsien-Wei; Huang Li-Hsien

Archive | 2017

Semiconductor package and forming method thereof

Chen Hsien-Wei; Huang Li-Hsien; Su An-Jhih; Chen Wei-Yu; Chen Ying-Ju

Archive | 2017

Forming method for multi-stack package-on-package structures

Lee Chi-Jung; Su An-Jhih; Chen Hsien-Wei; Huang Li-Hsien; Chen Wei-Yu; Yang Tien-Chung

Archive | 2017

REDISTRIBUTION LINES HAVING STACKING VIAS

Chen Hsien-Wei; Huang Li-Hsien

Archive | 2017

Pop devices and methods of forming the same

Tseng Hua-Wei; Su An-Jhih; Chen Hsien-Wei; Huang Li-Hsien; Yang Tien-Chung

Archive | 2017

Chip package structure with molding layer and method for forming the same

Chen Wei-Yu; Huang Li-Hsien; Su An-Jhih; Chen Hsien-Wei

Archive | 2017

Testing, Manufacturing, and Packaging Methods for Semiconductor Devices

Huang Li-Hsien; Cheng Yung-Shou; Lin Yan-Fu; Su An-Jhih; Wu Wei-Cheng; Chen Chin-Hsien; Chen Hsien-Wei; Yeh Der-Chyang

Archive | 2017

Umverteilungsleitungen mit gestapelten Durchkontaktierungen

Chen Hsien-Wei; Huang Li-Hsien

Archive | 2016

Package with under ball metallization (UBM) and methods of forming

Yu Chen-Hua; Li Chien-Yu; Kuo Hung-Jui; Huang Li-Hsien; Chen Hsien-Wei; Yeh Der-Chyang; Liu Chung-Shi; Jeng Shin-Puu

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Collaboration

Dive into the Huang Li-Hsien's collaboration.

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Chen Hsien-Wei

TSMC

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Su An-Jhih

TSMC

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Chen Wei-Yu

TSMC

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Yeh Der-Chyang

TSMC

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Jeng Shin-Puu

TSMC

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Kuo Hung-Jui

TSMC

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Li Chien-Yu

TSMC

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Liu Chung-Shi

TSMC

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Yang Tien-Chung

TSMC

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Yu Chen-Hua

TSMC

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