Cher Ming Tan

A framework to practical predictive maintenance modeling for multi-state systems

Abstract A simple practical framework for predictive maintenance (PdM)-based scheduling of multi-state systems (MSS) is developed. The maintenance schedules are derived from a system-perspective using the failure times of the overall system as estimated from its performance degradation trends. The system analyzed in this work is a flow transmission water pipe system. The various factors influencing PdM-based scheduling are identified and their impact on the system reliability and performance are quantitatively studied. The estimated times to replacement of the MSS may also be derived from the developed model. The results of the model simulation demonstrate the significant impact of maintenance quality and the criteria for the call for maintenance (user demand) on the system reliability and mean performance characteristics. A slight improvement in maintenance quality is found to postpone the system replacement time by manifold. The consistency in the quality of maintenance work with minimal variance is also identified as a very important factor that enhances the systems future operational and downtime event predictability. The studies also reveal that in order to reduce the frequency of maintenance actions, it is necessary to lower the minimum user demand from the system if possible, ensuring at the same time that the system still performs its intended function effectively. The model proposed can be utilized to implement a PdM program in the industry with a few modifications to suit the individual industrial systems’ needs.

Antibacterial action of dispersed single-walled carbon nanotubes on Escherichia coli and Bacillus subtilis investigated by atomic force microscopy

Single-walled carbon nanotubes (SWCNTs) exhibit strong antibacterial activities. Direct contact between bacterial cells and SWCNTs may likely induce cell damages. Therefore, the understanding of SWCNT-bacteria interactions is essential in order to develop novel SWCNT-based materials for their potential environmental, imaging, therapeutic, and military applications. In this preliminary study, we utilized atomic force microscopy (AFM) to monitor dynamic changes in cell morphology and mechanical properties of two typical bacterial models (gram-negative Escherichia coli and gram-positive Bacillus subtilis) upon incubation with SWCNTs. The results demonstrated that individually dispersed SWCNTs in solution develop nanotube networks on the cell surface, and then destroy the bacterial envelopes with leakage of the intracellular contents. The cell morphology changes observed on air dried samples are accompanied by an increase in cell surface roughness and a decrease in surface spring constant. To mimic the collision between SWCNTs and cells, a sharp AFM tip of 2 nm was chosen to introduce piercings on the cell surface. No clear physical damages were observed if the applied force was below 10 nN. Further analysis also indicates that a single collision between one nanotube and a bacterial cell is unlikely to introduce direct physical damage. Hence, the antibacterial activity of SWCNTs is the accumulation effect of large amount of nanotubes through interactions between SWCNT networks and bacterial cells.

Preparation and characterization of copper oxide thin films deposited by filtered cathodic vacuum arc

Copper oxide thin films deposited on Si (100) by a filtered cathodic vacuum arc with and without substrate bias have been studied by atomic force microscopy, x-ray diffraction (XRD), x-ray photoelectron spectroscopy (XPS) and Raman spectroscopy. The results show that the substrate bias significantly affects the surface morphology, crystalline phases and texture. In the film deposited without bias, two phases—cupric oxide (CuO) and cuprous oxide (Cu2O)—coexist as cross-evidenced by XRD, XPS and Raman analyses, whereas CuO is dominant concurrent with CuO (020) texture in the film deposited with bias. The film deposited with bias exhibits a more uniform and clearer surface morphology although both kinds of films are very smooth. Some explanations are given as well.

Aligned carbon nanotubes for through-wafer interconnects

Through-wafer interconnects by aligned carbon nanotube for three-dimensional stack integrated chip packaging applications have been reported in this letter. Two silicon wafers are bonded together by tetra-ethyl-ortho-silicate. The top wafer (100μm thick) with patterned through-holes allows carbon nanotubes to grow vertically from the catalyst layer (Fe) on the bottom wafer. By using thermal chemical vapor deposition technique, the authors have demonstrated the capability of growing aligned carbon nanotube bundles with an average length of 140μm and a diameter of 30μm from the through holes. The resistivity of the bundles is measured to be 0.0097Ωcm by using a nanomanipulator.

Electromigration performance of Through Silicon Via (TSV) – A modeling approach

The electromigration (EM) performance of Through Silicon Via (TSV) in silicon interposer application are studied using Finite Element (FE) modeling. It is found that thermo-mechanical stress is the dominant contribution factor to EM performance in TSV instead of the current density. The predicted failure site is dependent on the process technology, and exhibits asymmetric behavior if different process is used between the top and bottom metallization of a TSV. Modeling is also done for two different coverage patterns of top metallization, namely (i) the metal line covers the via completely, and (ii) the metal line only extends to the centre of the via, covering half of the via. The simulation results of the latter model show the existence of a second EM failure site and worse EM performance is expected. This additional possible EM failure site is further confirmed through dynamic simulation of void growth.

Revisit to the finite element modeling of electromigration for narrow interconnects

Electromigration (EM) is an important reliability concern in ultralarge-scale integration interconnects. A refined EM model based on a driving force approach is proposed in this work. The distribution of atomic flux divergence is computed by an finite element method to predict the void nucleation site in interconnects. It is demonstrated that the proposed model is more accurate than the conventional counterpart for narrow interconnects. The validity of the proposed model is verified through the study of the reservoir effect in EM. The predicted critical reservoir length agrees well with the reported values.

Current crowding effect on copper dual damascene via bottom failure for ULSI applications

Reliability of interconnect via is increasing an important issue in submicron technology. Electromigration experiments are performed on line/via structures in two level Cu dual damascene interconnection system and it is found that wide line/via fails earlier than the narrow line/via. Atomic flux divergence based finite element analyses is performed and stress-migration is found to be important in the failure rate behavior observed. Semi-classical width dependence Blacks equation together with the finite element analysis revealed that the difference in the time to failure is due to the much larger average current density along the interface between the line and via for the wide line/via structure, and good agreement is obtained between the simulation and experimental results.

Effect of Temperature on the Aging rate of Li Ion Battery Operating above Room Temperature

Temperature is known to have a significant impact on the performance, safety, and cycle lifetime of lithium-ion batteries (LiB). However, the comprehensive effects of temperature on the cyclic aging rate of LiB have yet to be found. We use an electrochemistry-based model (ECBE) here to measure the effects on the aging behavior of cycled LiB operating within the temperature range of 25 °C to 55 °C. The increasing degradation rate of the maximum charge storage of LiB during cycling at elevated temperature is found to relate mainly to the degradations at the electrodes, and that the degradation of LCO cathode is larger than graphite anode at elevated temperature. In particular, the formation and modification of the surface films on the electrodes as well as structural/phase changes of the LCO electrode, as reported in the literatures, are found to be the main contributors to the increasing degradation rate of the maximum charge storage of LiB with temperature for the specific operating temperature range. Larger increases in the Warburg elements and cell impedance are also found with cycling at higher temperature, but they do not seriously affect the state of health (SoH) of LiB as shown in this work.

Optimal maintenance strategy of deteriorating system under imperfect maintenance and inspection using mixed inspectionscheduling

An operating system suffers from degradation. Each degradation level can be represented by a state, making the system a multi-state system. In many situations, there are no apparent symptoms indicating the systems state, and systems degradation level can only be known through thorough inspection. Through condition monitoring, the systems state can be estimated with some uncertainty. In this work, we investigated inspection-maintenance schemes for such a system. Our assumptions are that the maintenance is imperfect and the degradation is a continuous-time Markov process. We proposed a strategy that combines both inspection and continuous monitoring to reduce unnecessary thorough inspection and to improve the systems reliability. Optimal maintenance strategy is derived based on an iterative algorithm to minimize the mean long-run costrate.

Temperature dependence of the field emission of multiwalled carbon nanotubes

The field emission characteristics of multiwalled carbon nanotubes at various temperatures are studied. It is found that the turn-on field and emission current at a given applied electric field are dependent on the ambient temperature of the nanotube. This dependence is believed to be due to the change in the work function of the nanotube on temperature, and the dependence of the work function with temperature is calculated. The direct application of such temperature dependence is a simple and low-cost nanothermometer.