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Chia-Fu Lin

TSMC

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Publication

Featured researches published by Chia-Fu Lin.

Archive | 2002

Method of making a wafer level chip scale package

Hsin-Hui Lee; Chia-Fu Lin; Chao-Yuan Su; Yen-Ming Chen; Kai-Ming Ching; Li-Chih Chen

Archive | 2002

Method of forming a solder ball using a thermally stable resinous protective layer

Chao-Yuan Su; Chia-Fu Lin; Hsin-Hui Lee; Yen-Ming Chen; Kai-Ming Ching; Li-Chih Chen

Archive | 2002

Method for improving bump reliability for flip chip devices

Yen-Ming Chen; Chia-Fu Lin; Shun-Liang Hsu; Kai-Ming Ching; Hsin-Hui Lee; Chao-Yuan Su; Li-Chih Chen

Archive | 2002

Method of measuring photoresist and bump misalignment

Yen-Ming Chen; Chia-Fu Lin; Kai-Ming Ching; Chao-Yuan Su; Hsin-Hui Lee; Li-Chih Chen

Archive | 2002

Fluxless bumping process

Chao-Yuan Su; Chia-Fu Lin; Hsin-Hui Lee; Yen-Ming Chen; Kai-Ming Ching; Li-Chih Chen; Wen-Chang Kuo; Yue-Ying Jian

Archive | 2001

Method to improve reliability for flip-chip device for limiting pad design

Yen-Ming Chen; Chia-Fu Lin; Kai-Ming Ching; Hsin-Hui Lee; Chao-Yuan Su; Li-Chi Chen

Archive | 2002

Fluxless bumping process using ions

Hsin-Hui Lee; Chia-Fu Lin; Chao-Yuan Su; Yeng-Ming Chen; Kai-Ming Chin; Li-Chi Chen; Hao-Chih Tien

Archive | 2002

DFR laminating and film removing system

Li-Chen Chen; Chia-Tsun Hsu; Chia-Fu Lin; Kuo-Ching Lee; Yen-Ming Chen; Kai-Ming Ching; Hsin-Hui Lee; Chao-Yuan Su

Archive | 2002

Microelectronic fabrication with corrosion inhibited bond pad

Yen-Ming Chen; Chia-Fu Lin; Yang-Tung Fan; Hong-Wen Huang; Cheng-Yu Chu

Archive | 2004

Novel method to improve bump reliability for flip chip device

Yen-Ming Chen; Chia-Fu Lin; Shun-Liang Hsu; Kai-Ming Ching; Hsin-Hui Lee; Chao-Yuan Su; Li-Chih Chen

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Collaboration

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Hsin-Hui Lee

TSMC

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Kai-Ming Ching

TSMC

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Yen-Ming Chen

TSMC

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Chao-Yuan Su

TSMC

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Li-Chih Chen

TSMC

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Shun-Liang Hsu

TSMC

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Ta-Min Lin

TSMC

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Wen-Hsiang Tseng

TSMC

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Cheng-Yu Chu

TSMC

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Li-Chi Chen

TSMC

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