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Dive into the research topics where Yen-Ming Chen is active.

Publication


Featured researches published by Yen-Ming Chen.


Archive | 2002

Colors only process to reduce package yield loss

Yang-Tung Fan; Chiou-Shian Peng; Cheng-Yu Chu; Shih-Jane Lin; Yen-Ming Chen; Fu-Jier Fan; Kuo-Wei Lin


Archive | 2002

Method of making a wafer level chip scale package

Hsin-Hui Lee; Chia-Fu Lin; Chao-Yuan Su; Yen-Ming Chen; Kai-Ming Ching; Li-Chih Chen


Archive | 2001

Method to form bump in bumping technology

Kuo-Wei Lin; Cheng-Yu Chu; Yen-Ming Chen; Yang-Tung Fan; Fu-Jier Fan; Chiou Shian Peng; Shih-Jang Lin


Archive | 1999

Method of manufacturing self-aligned T-shaped gate through dual damascene

Yen-Ming Chen; Wei-Jen Liu; Shih-Chi Lin; Kuo-Chou Liu


Archive | 2003

Bumping process to increase bump height and to create a more robust bump structure

Yang-Tung Fan; Cheng-Yu Chu; Fu-Jier Fan; Shih-Jane Lin; Chiou-Shian Peng; Yen-Ming Chen; Kuo-Wei Lin


Archive | 2010

SOURCE AND DRAIN FEATURE PROFILE FOR IMPROVING DEVICE PERFORMANCE AND METHOD OF MANUFACTURING SAME

Ming-Huan Tsai; Chun-Fai Cheng; Hui Ouyang; Yuan-Hung Chiu; Yen-Ming Chen


Archive | 1999

Method of manufacturing air gap in multilevel interconnection

Shih-Chi Lin; Yen-Ming Chen; Juin-Jie Chang; Kuei-Wu Huang


Archive | 1999

Method for fabricating fully dielectric isolated silicon (FDIS)

Shih-Chi Lin; Hui-ju Yu; Yen-Ming Chen; Hui-Hua Chang


Archive | 2002

Method to form a color image sensor cell while protecting the bonding pad structure from damage

Yang-Tung Fan; Cheng-Yu Chu; Chiou-Shian Peng; Shih-Jane Lin; Yen-Ming Chen; Fu-Jier Fan; Kuo-Wei Lin


Archive | 2001

METHOD OF FORMING A BUMP ON A COPPER PAD

Yen-Ming Chen; Kuo-Wei Lin; Cheng-Yu Chu; Yang-Tung Fan; Fu-Jier Fan; Shih-Jane Lin; Chiou-Shian Peng; Hsien-Tsung Liu

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