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Hsin-Hui Lee

TSMC

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Publication

Featured researches published by Hsin-Hui Lee.

Archive | 2005

Reducing cracking of high-lead or lead-free bumps by matching sizes of contact pads and bump pads

Szu Wei Lu; Hsin-Hui Lee; Chung Yu Wang; Mirng-Ji Lii

Archive | 2005

IC chip package structure and underfill process

Hsin-Hui Lee; Chien-Hsiun Lee

Archive | 2007

Scribe line layout design

Hsin-Hui Lee; Mirng-Ji Lii; Shin-puu Jeng; Shang-Yun Hou

Archive | 2010

Thermally Enhanced Wafer Level Package

Hsin-Hui Lee; Mirng-Ji Lii; Chien-Hsiun Lee

Archive | 2008

Contact pad and bump pad arrangement for high-lead or lead-free bumps

Szu Wei Lu; Hsin-Hui Lee; Chung Yu Wang; Mirng-Ji Lii

Archive | 2005

Novel method for copper wafer wire bonding

Chao-Yuan Su; Chender Huang; Chien-Hsiun Lee; Hsin-Hui Lee

Archive | 2010

STRUCTURE AND METHOD OF WAFER LEVEL CHIP MOLDED PACKAGING

Hsin-Hui Lee; William Cheng

Archive | 2009

Semiconductor package structures

Mirng-Ji Lii; Hsin-Hui Lee

Archive | 2007

Packaged semiconductor chip comprising an integrated circuit chip ablated with laser and cut with saw blade from wafer

Szu Wei Lu; Hsin-Hui Lee; Ming-Chung Sung; Mirng-Ji Lii

Archive | 2007

Methods for forming package structures

Hsin-Hui Lee; Mirng-Ji Lii

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Collaboration

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Mirng-Ji Lii

TSMC

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Chien-Hsiun Lee

TSMC

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Szu Wei Lu

TSMC

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William Cheng

TSMC

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Chung Yu Wang

TSMC

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Szu-Wei Lu

TSMC

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Chao-Yuan Su

TSMC

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Chen Yung Ching

TSMC

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Chender Huang

TSMC

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Hsin-Yu Pan

TSMC

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