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Latest external collaboration on country level. Dive into details by clicking on the dots.

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Dive into the research topics where Kai-Ming Ching is active.

Publication


Featured researches published by Kai-Ming Ching.


Archive | 2002

Method of making a wafer level chip scale package

Hsin-Hui Lee; Chia-Fu Lin; Chao-Yuan Su; Yen-Ming Chen; Kai-Ming Ching; Li-Chih Chen


Archive | 2002

Method of forming a solder ball using a thermally stable resinous protective layer

Chao-Yuan Su; Chia-Fu Lin; Hsin-Hui Lee; Yen-Ming Chen; Kai-Ming Ching; Li-Chih Chen


Archive | 2002

Method for improving bump reliability for flip chip devices

Yen-Ming Chen; Chia-Fu Lin; Shun-Liang Hsu; Kai-Ming Ching; Hsin-Hui Lee; Chao-Yuan Su; Li-Chih Chen


Archive | 2002

Method of measuring photoresist and bump misalignment

Yen-Ming Chen; Chia-Fu Lin; Kai-Ming Ching; Chao-Yuan Su; Hsin-Hui Lee; Li-Chih Chen


Archive | 2002

Fluxless bumping process

Chao-Yuan Su; Chia-Fu Lin; Hsin-Hui Lee; Yen-Ming Chen; Kai-Ming Ching; Li-Chih Chen; Wen-Chang Kuo; Yue-Ying Jian


Archive | 2001

Method to improve reliability for flip-chip device for limiting pad design

Yen-Ming Chen; Chia-Fu Lin; Kai-Ming Ching; Hsin-Hui Lee; Chao-Yuan Su; Li-Chi Chen


Archive | 2000

Selective electroplating method employing annular edge ring cathode electrode contact

Kai-Ming Ching; Sheng-Liang Pan; Hao-Wei Chang; Chun-Hong Chang; Yen-Ming Chen


Archive | 2002

DFR laminating and film removing system

Li-Chen Chen; Chia-Tsun Hsu; Chia-Fu Lin; Kuo-Ching Lee; Yen-Ming Chen; Kai-Ming Ching; Hsin-Hui Lee; Chao-Yuan Su


Archive | 2004

Novel method to improve bump reliability for flip chip device

Yen-Ming Chen; Chia-Fu Lin; Shun-Liang Hsu; Kai-Ming Ching; Hsin-Hui Lee; Chao-Yuan Su; Li-Chih Chen


Archive | 2002

Flush system for dry film photoresist remover

Ta-Min Lin; Szu-Yao Wang; Chia-Fu Lin; Kai-Ming Ching; Wen-Hsiang Tseng

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