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Chien-Hsun Lee

TSMC

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Publication

Featured researches published by Chien-Hsun Lee.

Archive | 2015

Substrate design for semiconductor packages and method of forming same

Chen-Hua Yu; Jung Wei Cheng; Tsung-Ding Wang; Chien-Hsun Lee

Archive | 2014

Integrated circuit package and methods of forming same

Chen-Hua Yu; Kuo-Chung Yee; Mirng-Ji Lii; Chien-Hsun Lee; Jiun Yi Wu

Archive | 2014

Thermal Performance Structure for Semiconductor Packages and Method of Forming Same

Jung Wei Cheng; Tsung-Ding Wang; Mirng-Ji Lii; Chien-Hsun Lee

Archive | 2012

Package on Package Devices and Methods of Forming Same

Chen-Hua Yu; Mirng-Ji Lii; Chien-Hsun Lee; Yung Ching Chen; Jiun Yi Wu

Archive | 2010

Methods for forming a semiconductor device package

Jung Wei Cheng; Tsung-Ding Wang; Chien-Hsun Lee; Chun-Chih Chuang

Archive | 2014

Semiconductor Package and Methods of Forming Same

Chen-Hua Yu; Kuo-Chung Yee; Mirng-Ji Lii; Chien-Hsun Lee; Jiun Yi Wu

Archive | 2016

PACKAGE-ON-PACKAGE STRUCTURE WITH ORGANIC INTERPOSER

Jiun Yi Wu; Yu-Min Liang; Mirng-Ji Lii; Chien-Hsun Lee; Tsung-Ding Wang; Jung Wei Cheng

Archive | 2013

Package-on-package structure and methods for forming the same

Chien-Hsun Lee; Jung Wei Cheng; Hao-Cheng Hou; Tsung-Ding Wang; Jiun Yi Wu; Ming-Chung Sung

Archive | 2013

Wafer level package structure and method of forming same

Chen-Hua Yu; Kuo-Chung Yee; Mirng-Ji Lii; Chien-Hsun Lee; Jiun Yi Wu

Archive | 2016

Packages with Stacked Dies and Methods of Forming the Same

Chien-Hsun Lee; Tsung-Ding Wang; Mirng-Ji Lii; Chen-Hua Yu

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Collaboration

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Chen-Hua Yu

TSMC

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Tsung-Ding Wang

TSMC

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Mirng-Ji Lii

TSMC

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Jung Wei Cheng

TSMC

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Jiun Yi Wu

TSMC

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Kuo-Chung Yee

TSMC

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Yung Ching Chen

TSMC

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Chun-Chih Chuang

TSMC

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Hao-Cheng Hou

TSMC

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Yu-Min Liang

TSMC

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