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Jung Wei Cheng

TSMC

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Publication

Featured researches published by Jung Wei Cheng.

Archive | 2015

Substrate design for semiconductor packages and method of forming same

Chen-Hua Yu; Jung Wei Cheng; Tsung-Ding Wang; Chien-Hsun Lee

Archive | 2011

Mold Chase Design for Package-on-Package Applications

Jung Wei Cheng; Chien-Hsiun Lee; Tsung-Ding Wang; Chun-Chih Chuang

Archive | 2017

PACKAGE STRUCTURES AND METHODS OF FORMING THE SAME

Hao-Cheng Hou; Ming-Che Liu; Chun-Chih Chuang; Jung Wei Cheng; Tsung-Ding Wang; Hung-Jen Lin

Archive | 2014

Thermal Performance Structure for Semiconductor Packages and Method of Forming Same

Jung Wei Cheng; Tsung-Ding Wang; Mirng-Ji Lii; Chien-Hsun Lee

Archive | 2010

Methods for forming a semiconductor device package

Jung Wei Cheng; Tsung-Ding Wang; Chien-Hsun Lee; Chun-Chih Chuang

Archive | 2016

PACKAGE-ON-PACKAGE STRUCTURE WITH ORGANIC INTERPOSER

Jiun Yi Wu; Yu-Min Liang; Mirng-Ji Lii; Chien-Hsun Lee; Tsung-Ding Wang; Jung Wei Cheng

Archive | 2013

Package-on-package structure and methods for forming the same

Chien-Hsun Lee; Jung Wei Cheng; Hao-Cheng Hou; Tsung-Ding Wang; Jiun Yi Wu; Ming-Chung Sung

Archive | 2015

3D INTEGRATED CIRCUIT PACKAGE PROCESSING WITH PANEL TYPE LID

Tsung-Ding Wang; Han-ping Pu; Kim Hong Chen; Jung Wei Cheng; Chien Ling Hwang; Hsin-yu Pan

Archive | 2014

Dam for Three-Dimensional Integrated Circuit

Tsung-Ding Wang; An-Jhih Su; Chien Ling Hwang; Jung Wei Cheng; Hsin-Yu Pan; Chen-Hua Yu

Archive | 2012

Molded Underfilling for Package on Package Devices

Chen-Hua Yu; Chien-Hsun Lee; Jung Wei Cheng; Tsung-Ding Wang; Ming-Da Cheng; Yung Ching Chen

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Collaboration

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Tsung-Ding Wang

TSMC

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Chien-Hsun Lee

TSMC

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Chun-Chih Chuang

TSMC

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Chen-Hua Yu

TSMC

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Hao-Cheng Hou

TSMC

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Chien Ling Hwang

TSMC

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Hung-Jen Lin

TSMC

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Jiun Yi Wu

TSMC

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Ming-Che Liu

TSMC

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Mirng-Ji Lii

TSMC

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