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Latest external collaboration on country level. Dive into details by clicking on the dots.

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Dive into the research topics where Chin-Kwan Kim is active.

Publication


Featured researches published by Chin-Kwan Kim.


Archive | 2014

Ultra fine pitch and spacing interconnects for substrate

Chin-Kwan Kim; Rajneesh Kumar; Omar James Bchir


Archive | 2013

Embedded bridge structure in a substrate

Chin-Kwan Kim; Omar James Bchir; Dong Wook Kim; Hong Bok We


Archive | 2014

Package-on-package structure with reduced height

Chin-Kwan Kim; Omar James Bchir; Milind P. Shah; Marcus Hsu; David Fraser Rae


Archive | 2013

SURFACE FINISH ON TRACE FOR A THERMAL COMPRESSION FLIP CHIP (TCFC)

Houssam Wafic Jomaa; Omar James Bchir; Milind P. Shah; Manuel Aldrete; Chin-Kwan Kim


Archive | 2015

Semiconductor package interconnections and method of making the same

Dong Wook Kim; Jae Sik Lee; Hong Bok We; Young Kyu Song; Chin-Kwan Kim; Kyu-Pyung Hwang; Shiqun Gu


Archive | 2015

System, apparatus, and method for split die interconnection

Ahmer Syed; Chin-Kwan Kim; Omar James Bchir; Milind P. Shah; Ryan David Lane


Archive | 2016

Reinforced wafer level package comprising a core layer for reducing stress in a solder joint and improving solder joint reliability

Chin-Kwan Kim; Rajneesh Kumar; Vladimir Noveski; Jie Fu; Ahmer Syed; Milind P. Shah; Omar James Bchir


Archive | 2015

Semiconductor package with embedded components and method of making the same

Chin-Kwan Kim; David Fraser Rae; Rajneesh Kumar; Milind P. Shah; Omar James Bchir


Archive | 2015

Substrate and method of forming the same

Houssam Wafic Jomaa; Omar James Bchir; Kuiwon Kang; Chin-Kwan Kim


Archive | 2014

Barrier layer on bump and non-wettable coating on trace

Omar James Bchir; Milind P. Shah; Houssam Wafic Jomaa; Manuel Aldrete; Chin-Kwan Kim

Collaboration


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