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Hong Bok We

Qualcomm

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Publication

Featured researches published by Hong Bok We.

Archive | 2013

Embedded bridge structure in a substrate

Chin-Kwan Kim; Omar James Bchir; Dong Wook Kim; Hong Bok We

Archive | 2016

INTEGRATED DEVICE PACKAGE COMPRISING SILICON BRIDGE IN PHOTO IMAGEABLE LAYER

Hong Bok We; Dong Wook Kim; Jae Sik Lee; Kyu-Pyung Hwang; Young Kyu Song

Archive | 2015

Integrated device package comprising silicon bridge in an encapsulation layer

Jae Sik Lee; Hong Bok We; Dong Wook Kim; Shiqun Gu

Archive | 2016

SEMICONDUCTOR PACKAGE ON PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

Hong Bok We; Dong Wook Kim; Jae Sik Lee; Kyu-Pyung Hwang; Young Kyu Song

Archive | 2015

Semiconductor package interconnections and method of making the same

Dong Wook Kim; Jae Sik Lee; Hong Bok We; Young Kyu Song; Chin-Kwan Kim; Kyu-Pyung Hwang; Shiqun Gu

Archive | 2016

Integrated device package comprising bridge in litho-etchable layer

Shiqun Gu; Hong Bok We; Jae Sik Lee; Dong Wook Kim

Archive | 2016

SEMICONDUCTOR PACKAGE WITH HIGH DENSITY DIE TO DIE CONNECTION AND METHOD OF MAKING THE SAME

Hong Bok We; Dong Wook Kim; Jae Sik Lee

Archive | 2016

CAVITY BRIDGE CONNECTION FOR DIE SPLIT ARCHITECTURE

Hong Bok We; Jae Sik Lee; Dong Wook Kim

Archive | 2015

Interposer for a package-on-package structure

Jae Sik Lee; Kyu-Pyung Hwang; Hong Bok We

Archive | 2015

HIGH DENSITY FAN OUT PACKAGE STRUCTURE

Dong Wook Kim; Hong Bok We; Jae Sik Lee; Shiqun Gu

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Collaboration

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Dong Wook Kim

Qualcomm

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Jae Sik Lee

Qualcomm

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Kyu-Pyung Hwang

Qualcomm

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Shiqun Gu

Qualcomm

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Young Kyu Song

Qualcomm

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Chin-Kwan Kim

Qualcomm

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Omar James Bchir

Qualcomm

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Ratibor Radojcic

Qualcomm

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Seung H. Kang

Qualcomm

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