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Ching-Wen Hsiao

TSMC

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Publication

Featured researches published by Ching-Wen Hsiao.

Archive | 2012

PoP structures including through-assembly via modules

Chih-Hua Chen; Chen-Shien Chen; Ching-Wen Hsiao

Archive | 2010

Formation of TSV Backside Interconnects by Modifying Carrier Wafers

Hon-Lin Huang; Ching-Wen Hsiao; Kuo-Ching Hsu; Chen-Shien Chen

Archive | 2010

Under-Bump Metallization Structure for Semiconductor Devices

Ming-Hung Tseng; Chen-Shien Chen; Chen-Cheng Kuo; Chih-Hua Chen; Ching-Wen Hsiao

Archive | 2010

Front side copper post joint structure for temporary bond in TSV application

Hon-Lin Huang; Ching-Wen Hsiao; Kuo-Ching Hsu; Chen-Shien Chen

Archive | 2010

Thin wafer handling structure and method

Chen-Hua Yu; Kuo-Ching Hsu; Chen-Shien Chen; Ching-Wen Hsiao

Archive | 2009

Cooling channels in 3DIC stacks

Kai-Ming Ching; Ching-Wen Hsiao; Tsung-Ding Wang; Ming Hung Tseng; Chen-Shien Chen

Archive | 2010

METHOD OF FORMING STACKED-DIE PACKAGES

Ching-Wen Hsiao; Bo-l Lee; Tsung-Ding Wang; Kai-Ming Ching; Chen-Shien Chen; Chien-Hsiun Lee; Clinton Chao

Archive | 2012

Through-assembly via modules and methods for forming the same

Chih-Hua Chen; Chen-Shien Chen; Ching-Wen Hsiao

Archive | 2008

Three-Dimensional Integrated Circuit Stacking-Joint Interface Structure

Ming-Hong Tseng; Kai-Ming Ching; Chen-Shien Chen; Ching-Wen Hsiao; Hon-Lin Huang; Tsung-Ding Wang

Archive | 2010

Methods and Apparatus for Robust Flip Chip Interconnections

Yao-Chun Chuang; Ching-Wen Hsiao; Chen-Cheng Kuo; Chen-Shien Chen

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Chen-Shien Chen

TSMC

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Kuo-Ching Hsu

TSMC

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Chen-Cheng Kuo

TSMC

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Hon-Lin Huang

TSMC

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Chih-Hua Chen

TSMC

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Kai-Ming Ching

TSMC

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Tsung-Ding Wang

TSMC

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Yao-Chun Chuang

TSMC

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Bo-l Lee

TSMC

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Chen-Hua Yu

TSMC

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