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Hon-Lin Huang

TSMC

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Publication

Featured researches published by Hon-Lin Huang.

Archive | 2008

Introducing a Metal Layer Between Sin and Tin to Improve CBD Contact Resistance for P-TSV

Kuo-Ching Hsu; Chen-Shien Chen; Boe Su; Hon-Lin Huang

Archive | 2011

Bond pad connection to redistribution lines having tapered profiles

Kuo-Ching Hsu; Chen-Shien Chen; Hon-Lin Huang

Archive | 2010

Wafer Backside Structures Having Copper Pillars

Chen-Hua Yu; Hon-Lin Huang; Kuo-Ching Hsu; Chen-Shien Chen

Archive | 2010

Formation of TSV Backside Interconnects by Modifying Carrier Wafers

Hon-Lin Huang; Ching-Wen Hsiao; Kuo-Ching Hsu; Chen-Shien Chen

Archive | 2010

Front side copper post joint structure for temporary bond in TSV application

Hon-Lin Huang; Ching-Wen Hsiao; Kuo-Ching Hsu; Chen-Shien Chen

Archive | 2016

Interconnect structure and method of forming the same

Yu-Hung Lin; Mei-Hui Fu; Wei-Jung Lin; You-Hua Chou; Chia-Lin Hsu; Hon-Lin Huang; Shih-Chi Lin

Archive | 2007

Through-silicon via interconnection formed with a cap layer

Hon-Lin Huang; Boe Su; Li-Hsin Tseng; Chia-Jen Cheng; Hsiu-Mei Yu

Archive | 2008

Three-Dimensional Integrated Circuit Stacking-Joint Interface Structure

Ming-Hong Tseng; Kai-Ming Ching; Chen-Shien Chen; Ching-Wen Hsiao; Hon-Lin Huang; Tsung-Ding Wang

Archive | 2013

Die Edge Contacts for Semiconductor Devices

Yi-Jen Lai; You-Hua Chou; Hon-Lin Huang; Huai-Tei Yang

Archive | 2009

BONDING PAD CONNECTED WITH TAPER-SHAPED REDISTRIBUTION LINE

Chen-Shien Chen; Kuo-Ching Hsu; Hon-Lin Huang; 國經 許; 承先 陳; 宏麟 黄

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Collaboration

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Chen-Shien Chen

TSMC

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Kuo-Ching Hsu

TSMC

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Ching-Wen Hsiao

TSMC

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Boe Su

TSMC

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Shih-Chi Lin

TSMC

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You-Hua Chou

TSMC

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Yu-Hung Lin

TSMC

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Chen-Hua Yu

TSMC

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Chia-Jen Cheng

TSMC

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Chia-Lin Hsu

TSMC

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