Chishio Koshimizu

Simultaneous measurement of substrate temperature and thin-film thickness on SiO2/Si wafer using optical-fiber-type low-coherence interferometry

This paper proposes a technique for simultaneously monitoring the thickness of a SiO2 thin film and the temperature of a Si substrate. This technique uses low-coherence interferometry and has the potential to be used for online monitoring of semiconductor manufacturing processes. In low-coherence interferometry, when the optical path length of a layer is shorter than the coherence length of the light source, the two interference at the top and bottom interfaces of the layer overlap each other. In this case the detected peak position of the interference is shifted from the actual interface, resulting in an error in the temperature measurement, since the temperature is derived from the optical path length of the layer. To improve the accuracy of the temperature measurement, the effect of the overlapping interference was compensated by measuring the SiO2 thickness. The thickness of the Si substrate was 750u2002μm and the thickness of the SiO2 film was varied between 0 and 2u2002μm. The SiO2 thickness, which is short...

Direct current superposed dual-frequency capacitively coupled plasmas in selective etching of SiOCH over SiC

Superpositioning of negative dc bias in dual-frequency capacitively coupled plasmas (dc-superposed (DS)-CCP) was realized for the selective etching of carbon-doped silicon oxide (SiOCH) films over carbon-doped amorphous silicon (SiC) films, while the dc bias exceeded about ?800?V. When a dc bias of ?1200?V was superposed on 60?MHz VHF power on the top electrode opposed to a wafer on the bottom electrode biased with 13.56?MHz power, a selectivity of above 50 for SiOCH over SiC was obtained. From characterization of the plasma density and various chemical species in the gaseous phase, such as CF2, CF and atomic N, the density of CF2 significantly decreased with the application of dc bias ranging from ?800 to ?1200?V. This indicated that CF2 radicals were consumed at the surface of the counter electrode which was made of silicon. The bulk densities of the species including CF2 were decreased, especially due to excess surface loss caused by the bombardment of highly energetic ions accelerated by the superposed dc bias, as well as the rf sheath for the superposition of the negative dc bias. The DS-CCP technology is thus concluded to be indispensable for yielding highly selective etching of SiOCH over SiC.

Low-Coherence Interferometry-Based Non-Contact Temperature Monitoring of a Silicon Wafer and Chamber Parts during Plasma Etching

We performed real-time non-contact monitoring of temperatures of a silicon wafer and chamber parts in plasma etching processes using optical fiber-based low-coherence interferometry. The measurements were performed in dual-frequency capacitively coupled Ar/C4F8/O2 plasma processes. The temperature of a 780-µm-thick Si wafer was measured with a deviation of 0.11 K. Comparison between in-situ measurement results of an on-wafer temperature sensor and an optical-fiber type fluorescence temperature sensor confirmed that the low-coherence interferometry had superior performance in monitoring the temperature of the Si wafer in real-time. This method will enable better control of etching performance with improved process reproducibility.

Spatial Distributions of Electron, CF, and CF2 Radical Densities and Gas Temperature in DC-Superposed Dual-Frequency Capacitively Coupled Plasma Etch Reactor Employing Cyclic-C4F8/N2/Ar Gas

On a plasma etch reactor for a wafer of 300 mm in diameter, the spatial distributions of the absolute densities of CF and CF2 radicals, electron density (ne), and the gas temperature (Tg) of N2 were measured employing the dual frequency of negative dc voltage superposed to a very high frequency (VHF) of 60 MHz capacitively coupled plasma (DS-2f-CCP) with the cyclic- (c-)C4F8/Ar/N2 gas mixture. The dc bias was superposed on the upper electrode with a frequency of 60 MHz. The distributions of electron and radical densities were uniform within a diameter of about 260 mm, and took a monotonic decay in regions outside a diameter of 260 mm on the reactor for 300 mm wafers in the reactor. It was found that only CF2 density at the radial position between 150 and 180 mm, corresponding to the position of the Si focus ring, dropped, while CF density took a uniform distribution over a diameter of 260 mm. Additionally, at this position, the rotational temperature of N2 gas increased to be 100 K larger than that at the center position. CF2 radical density was markedly affected by the modified surface loss probability of the material owing to coupling with surface temperature.

Simultaneous In situ Measurement of Silicon Substrate Temperature and Silicon Dioxide Film Thickness during Plasma Etching of Silicon Dioxide Using Low-Coherence Interferometry

We have successfully performed real-time noncontact monitoring of substrate temperature and thin film thickness during plasma etching using optical-fiber-based low-coherence interferometry. The simultaneous measurement of the silicon (Si) substrate temperature and the etching depth of the silicon dioxide (SiO2) thin film on this substrate was performed in a dual-frequency capacitively coupled Ar/C4F8/O2 plasma. The SiO2 film thickness was deduced from the ratio of the interference intensity at the SiO2/Si interface to that at the Si/air interface. The measurement error in the SiO2 film thickness was less than 11 nm. The temperature variation of the Si wafer was derived from the temperature change of its optical path length. The temperature measurement error, caused by the shift in optical path length due to the change in SiO2 film thickness, was reduced from 7.5 to 0.6 °C by compensating for the shift using the SiO2 thickness data. This method enables precise control of etching performance and improves process reproducibility.