Christian M. Gronet

Limited reaction processing: In-situ metal—oxide—semiconductor capacitors

Limited reaction processing (LRP) has been used to fabricate in-situ silicon-silicon dioxide-polycrystalline silicon layers for metal-oxide-semiconductor (MOS) capacitors. The process consists of multiple in-situ rapid thermal processing steps to grow or deposit different layers. Capacitors have been fabricated from these layers and analyzed by capacitance-voltage measurements for interfacial fixed charge and interface state density. The capacitors exhibit excellent characteristics.

Growth of GeSi/Si Strained-layer Superlattices Using Limited Reaction Processing

SiGe/Si superlattices were grown using limited reaction processing in a chamber which allows both W-halogen and Hg arc wafer illumination. Each multilayer structure was fabricated in-situ by changing the gas composition between high temperature cycles. Commensurate SiGe alloy layers as thin as 15 nm were reproducibly deposited and were examined using transmission electron microscopy, sputtering Auger electron spectroscopy,and Rutherford backscattering. Preliminary results are presented on UV/ozone cleaning of LRP substrates to remove residual carbon contamination in-situ prior to film deposition.

Limited Reaction Processing

Limited reaction processing (LRP), a new technique which provides precise control of thermally driven surface reactions, was used to grow multilayer structures composed of semiconductors and insulators. Results are presented for group IV-based materials including epitaxial Si, SiGe alloys, SiO 2 , and polysilicon. III–V materials such as GaAs, AlGaAs, and InGaAs have also been successfully grown. A number of diagnostic techniques were used to define the advantages and capabilities of LRP, including TEM, SIMS and AES. In addition, some preliminary device results are presented.