Claudio Resta

A Bipolar-Selected Phase Change Memory Featuring Multi-Level Cell Storage

In this paper, a 90-nm 128-Mcell non-volatile memory based on phase-change Ge2-Sb2-TeB alloy is presented. Memory cells are bipolar selected, and are based on a /xtrench architecture. Experimental investigation on multi-level cell (MLC) storage is addressed exploiting the chip MLC capability. To this end, a programming algorithm suitable for 2 bit/cell storage achieving tightly placed inner states (in terms of cell current or resistance) is proposed. Measurements showed the possibility of placing the required distinct cell current distributions, thus demonstrating the feasibility of the MLC phase-change memory (PCM) storage concept. Endurance tests were also carried out. Cumulative distribu tions after 2-bit/cell programming before cycling and after 100 k program cycles followed by 1 h/150 degC bake are presented. Experimental results on MLC endurance are also provided from a 180-nm 8-Mb PCM demonstrator with the same mutrench cell structure.

An 8Mb demonstrator for high-density 1.8V Phase-Change Memories

An 8Mb Non-Volatile Memory Demonstrator incorporating a novel 0.32 /spl mu/m/sup 2/ Phase-Change Memory (PCM) cell using a Bipolar Junction Transistor (BJT) as selector and integrated into a 3V 0.18 /spl mu/m CMOS technology is presented. Realistically large 4Mb tiles with a voltage regulation scheme that allows fast bitline precharge and sense are proposed. An innovative approach that minimizes the array leakage has been used to verify the feasibility of high-density PCM memories with improved Read/Write performance compared to Flash. Finally, cells distributions and first endurance measurements demonstrate the chip functionality and a good working window.

A Multi-Level-Cell Bipolar-Selected Phase-Change Memory

Phase-change memory (PCM) is becoming widely recognized as the most likely candidate to unify the many memory technologies that exist today (Lee, et al., 2007). The combination of non-volatile attributes of flash, RAM-like bit-alterability, and fast reads and writes position PCM to enable changes in the memory subsystems of cellular phones, PCs and countless embedded and consumer electronics applications. This designs multi-level cell (MLC) capabilities combined with long- term scalability reduce PCM costs as only realized before by hard disk drives. MLC technology is challenged with fitting more cell states (4 in the case of 2 bit per cell), along with distribution spreads due to process, design, and environmental variations, within a limited window. We describe a 256Mb MLC test-chip in a 90nm micro-trench (mutrench) PCM technology, and MLC endurance results from an 8Mb 0.18mum PCM test-chip with the same trench cell structure. A program algorithm achieving tightly placed inner states and experimental results illustrating distinct current distributions are presented to demonstrate MLC capability.