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Clinton Chao

TSMC

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Publication

Featured researches published by Clinton Chao.

Archive | 2007

Low-cost and ultra-fine integrated circuit packaging technique

Clinton Chao

Archive | 2007

Design techniques for stacking identical memory dies

Chao-Shun Hsu; Louis Liu; Clinton Chao; Mark Shane Peng

Archive | 2006

Electromagnetic shielding using through-silicon vias

Clinton Chao; Chao-Shun Hsu; Mark Shane Peng; Szu Wei Lu; Tjandra Winata Karta

Archive | 2013

Programmable semiconductor interposer for electronic package and method of forming

Chao-Shun Hsu; Clinton Chao; Mark Shane Peng

Archive | 2008

Method for stacking devices

Dean Wang; Chien-Hsiun Lee; Chen-Shien Chen; Clinton Chao; Mirng-Ji Lii; Tjandra Winata Karta

Archive | 2009

Semiconductor device including electrically conductive bump and method of manufacturing the same

Clinton Chao; Pei-Haw Tsao; Szu Wei Lu; Tjandra Winata Karta

Archive | 2007

METHODS FOR FORMING SINGLE DIES WITH MULTI-LAYER INTERCONNECT STRUCTURES AND STRUCTURES FORMED THEREFROM

Chao-Shun Hsu; Chen-Yao Tang; Clinton Chao; Mark Shane Peng

Archive | 2006

Silicon-Based Thin Substrate and Packaging Schemes

Szu Wei Lu; Clinton Chao; Ann Luh; Tjandra Winata Karta; Jerry Tzou; Kuo-chin Chang

Archive | 2006

STACKED STRUCTURES AND METHODS OF FABRICATING STACKED STRUCTURES

Clinton Chao; Tsorng-Dih Yuan; Hsin-yu Pan; Kim Hong Chen; Mark Shane Peng; Tjandra Winata Karta

Archive | 2007

Wafer-level flip-chip assembly methods

Chien-Hsiun Lee; Clinton Chao; Ming-Chung Sung; Tjandra Winata Karta

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Collaboration

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Tjandra Winata Karta

TSMC

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Chao-Shun Hsu

TSMC

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Mark Shane Peng

TSMC

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Szu Wei Lu

TSMC

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Chien-Hsiun Lee

TSMC

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Chen-Shien Chen

TSMC

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Hua-Shu Wu

TSMC

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Louis Liu

TSMC

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Ming Cheng Hsu

TSMC

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Shin-puu Jeng

TSMC

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