Network


Latest external collaboration on country level. Dive into details by clicking on the dots.

Hotspot


Dive into the research topics where Chien-Hsiun Lee is active.

Publication


Featured researches published by Chien-Hsiun Lee.


Archive | 2008

Method for stacking devices

Dean Wang; Chien-Hsiun Lee; Chen-Shien Chen; Clinton Chao; Mirng-Ji Lii; Tjandra Winata Karta


Archive | 2012

Package on Package Devices and Methods of Packaging Semiconductor Dies

Chen-Hua Yu; Chien-Hsiun Lee; Chen Yung Ching


Archive | 2007

Enhanced reliability of wafer-level chip-scale packaging (WLCSP) die separation using dry etching

Tjandra Winata Karta; Steven Hsu; Chien-Hsiun Lee; Gene Wu; Jimmy Liang


Archive | 2007

Protected solder ball joints in wafer level chip-scale packaging

Chung Yu Wang; Chien-Hsiun Lee; Pei-Haw Tsao; Kuo-Chin Chang; Chung-Yi Lin; Bill Kiang


Archive | 2008

Through silicon via bonding structure

Dean Wang; Chen-Shien Chen; Kai-Ming Ching; Bo-I Lee; Chien-Hsiun Lee


Archive | 2005

IC chip package structure and underfill process

Hsin-Hui Lee; Chien-Hsiun Lee


Archive | 2008

Fixture for p-through silicon via assembly

Chien-Hsiun Lee; Chen-Shien Chen; Mirng-Ji Lii; Tjandra Winata Karta


Archive | 2003

Thermal dispensing enhancement for high performance flip chip BGA (HPFCBGA)

Daniel Lee; Chender Huang; Chien-Hsiun Lee


Archive | 2011

Mold Chase Design for Package-on-Package Applications

Jung Wei Cheng; Chien-Hsiun Lee; Tsung-Ding Wang; Chun-Chih Chuang


Archive | 2010

Thermally Enhanced Wafer Level Package

Hsin-Hui Lee; Mirng-Ji Lii; Chien-Hsiun Lee

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