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Tjandra Winata Karta

TSMC

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Publication

Featured researches published by Tjandra Winata Karta.

Archive | 2006

Electromagnetic shielding using through-silicon vias

Clinton Chao; Chao-Shun Hsu; Mark Shane Peng; Szu Wei Lu; Tjandra Winata Karta

Archive | 2008

Method for stacking devices

Dean Wang; Chien-Hsiun Lee; Chen-Shien Chen; Clinton Chao; Mirng-Ji Lii; Tjandra Winata Karta

Archive | 2007

Enhanced reliability of wafer-level chip-scale packaging (WLCSP) die separation using dry etching

Tjandra Winata Karta; Steven Hsu; Chien-Hsiun Lee; Gene Wu; Jimmy Liang

Archive | 2007

Back End Integrated WLCSP Structure without Aluminum Pads

Hsiu-Mei Yu; Tjandra Winata Karta; Daniel Yang; Shih-Ming Chen; Chia-Jen Cheng

Archive | 2009

Semiconductor device including electrically conductive bump and method of manufacturing the same

Clinton Chao; Pei-Haw Tsao; Szu Wei Lu; Tjandra Winata Karta

Archive | 2008

Fixture for p-through silicon via assembly

Chien-Hsiun Lee; Chen-Shien Chen; Mirng-Ji Lii; Tjandra Winata Karta

Archive | 2006

Silicon-Based Thin Substrate and Packaging Schemes

Szu Wei Lu; Clinton Chao; Ann Luh; Tjandra Winata Karta; Jerry Tzou; Kuo-chin Chang

Archive | 2006

STACKED STRUCTURES AND METHODS OF FABRICATING STACKED STRUCTURES

Clinton Chao; Tsorng-Dih Yuan; Hsin-yu Pan; Kim Hong Chen; Mark Shane Peng; Tjandra Winata Karta

Archive | 2007

Wafer-level flip-chip assembly methods

Chien-Hsiun Lee; Clinton Chao; Ming-Chung Sung; Tjandra Winata Karta

Archive | 2006

Stratified underfill in an IC package

Mirng-Ji Lii; Szu Wei Lu; Tjandra Winata Karta; Chien-Hsiun Lee

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Collaboration

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Clinton Chao

TSMC

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Chien-Hsiun Lee

TSMC

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Mirng-Ji Lii

TSMC

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Szu Wei Lu

TSMC

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Chen-Shien Chen

TSMC

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Dean Wang

TSMC

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Jerry Tzou

TSMC

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Jimmy Liang

TSMC

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Kuo-chin Chang

TSMC

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Mark Shane Peng

TSMC

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