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Dai Fukushima

Toshiba

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Publication

Featured researches published by Dai Fukushima.

Archive | 2004

Slurry for CMP, polishing method and method of manufacturing semiconductor device

Gaku Minamihaba; Dai Fukushima; Susumu Yamamoto; Hiroyuki Yano

Archive | 2006

CMP slurry for metallic film, polishing method and method of manufacturing semiconductor device

Gaku Minamihaba; Dai Fukushima; Nobuyuki Kurashima; Susumu Yamamoto; Hiroyuki Yano

Archive | 2003

Slurry for CMP, method of forming thereof and method of manufacturing semiconductor device including a CMP process

Yukiteru Matsui; Gaku Minamihaba; Hiroyuki Yano; Dai Fukushima

Archive | 2007

Slurry for CMP of Cu film, polishing method and method for manufacturing semiconductor device

Gaku Minamihaba; Dai Fukushima; Hiroyuki Yano

Archive | 2007

AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING, CHEMICAL MECHANICAL POLISHING METHOD, KIT FOR CHEMICAL MECHANICAL POLISHING, AND KIT FOR PREPARING AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING

Kazuhito Uchikura; Hirotaka Shida; Yuuichi Hashiguchi; Gaku Minamihaba; Dai Fukushima; Yoshikuni Tateyama; Hiroyuki Yano

Archive | 2006

Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion, chemical mechanical polishing process, and process for producing semiconductor devices

Hirotaka Shida; Akihiro Takemura; Masayuki Hattori; Gaku Minamihaba; Dai Fukushima; Nobuyuki Kurashima; Susumu Yamamoto; Yoshikuni Tateyama; Hiroyuki Yano

Archive | 2003

Semiconductor device containing a dummy wire

Nobuyuki Kurashima; Gaku Minamihaba; Dai Fukushima; Yoshikuni Tateyama; Hiroyuki Yano

Archive | 2000

Semiconductor device having a damascene type wiring layer

Hiroshi Toyoda; Hiroyuki Yano; Gaku Minamihaba; Dai Fukushima; Tetsuo Matsuda; Hisashi Kaneko

Archive | 2006

AQUEOUS DISPERSION FOR CMP, POLISHING METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Gaku Minamihaba; Nobuyuki Kurashima; Dai Fukushima; Yukiteru Matsui; Susumu Yamamoto; Hiroyuki Yano

Archive | 2007

Slurry for touch-up CMP and method of manufacturing semiconductor device

Gaku Minamihaba; Nobuyuki Kurashima; Dai Fukushima; Takatoshi Ono; Susumu Yamamoto; Hiroyuki Yano

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Collaboration

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Hiroyuki Yano

Toshiba

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Gaku Minamihaba

Toshiba

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Yoshikuni Tateyama

Toshiba

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Nobuyuki Kurashima

Toshiba

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Susumu Yamamoto

Toshiba

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Hirotaka Shida

Toshiba

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Akihiro Takemura

Toshiba

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Masayuki Hattori

Toshiba

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Atsushi Shigeta

Toshiba

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Hiroshi Toyoda

Toshiba

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