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Dive into the research topics where Nobuyuki Kurashima is active.

Publication


Featured researches published by Nobuyuki Kurashima.


Archive | 2001

Slurry for chemical mechanical polishing and method of manufacturing semiconductor device

Gaku Minamihaba; Hiroyuki Yano; Nobuyuki Kurashima; Nobuo Kawahashi; Masayuki Hattori; Kazuo Nishimoto


Archive | 2006

CMP slurry for metallic film, polishing method and method of manufacturing semiconductor device

Gaku Minamihaba; Dai Fukushima; Nobuyuki Kurashima; Susumu Yamamoto; Hiroyuki Yano


Archive | 2001

Slurry for chemical mechanical polishing and manufacturing method of semiconductor device

Masayuki Hattori; Nobuo Kawahashi; Nobuyuki Kurashima; Fukugaku Minami; Kazuo Nishimoto; Hiroyuki Yano; 延行 倉嶋; 学 南幅; 信夫 川橋; 雅幸 服部; 博之 矢野; 和男 西元


Archive | 2007

Cleaning composition, cleaning method, and manufacturing method of semiconductor device

Michiaki Andou; Tomohisa Konno; Hirotaka Shida; Kazuhito Uchikura; Nobuyuki Kurashima; Gaku Minamihaba; Yoshikuni Tateyama; Hiroyuki Yano


Archive | 2004

Water dispersion for chemical mechanical polishing and chemical mechanical polishing method

Masaru Fukushima; Masayuki Hattori; Nobuo Kawahashi; Nobuyuki Kurashima; Yukiteru Matsui; Fukugaku Minami; Kazuo Nishimoto; Kazuichi Uchikura; Hiroyuki Yano; 延行 倉嶋; 和一 内倉; 学 南幅; 信夫 川橋; 雅幸 服部; 之輝 松井; 博之 矢野; 大 福島; 和男 西元


Archive | 2006

Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion, chemical mechanical polishing process, and process for producing semiconductor devices

Hirotaka Shida; Akihiro Takemura; Masayuki Hattori; Gaku Minamihaba; Dai Fukushima; Nobuyuki Kurashima; Susumu Yamamoto; Yoshikuni Tateyama; Hiroyuki Yano


Archive | 2005

Post-CMP treating liquid and method for manufacturing semiconductor device

Gaku Minamihaba; Yukiteru Matsui; Nobuyuki Kurashima; Hiroyuki Yano


Archive | 2003

Semiconductor device containing a dummy wire

Nobuyuki Kurashima; Gaku Minamihaba; Dai Fukushima; Yoshikuni Tateyama; Hiroyuki Yano


Archive | 2002

Polishing slurry for use in CMP of SiC series compound, polishing method, and method of manufacturing semiconductor device

Gaku Minamihaba; Hiroyuki Yano; Nobuyuki Kurashima


Archive | 2002

Post cmp (chemical mechanical polishing) processing liquid, and method of manufacturing semiconductor device using the same

Nobuyuki Kurashima; Yukiteru Matsui; Fukugaku Minami; Hiroyuki Yano; 倉嶋 延行; 南幅 学; 松井 之輝; 矢野 博之

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