Nobuyuki Kurashima | Researchain

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Archive | 2001

Slurry for chemical mechanical polishing and method of manufacturing semiconductor device

Gaku Minamihaba; Hiroyuki Yano; Nobuyuki Kurashima; Nobuo Kawahashi; Masayuki Hattori; Kazuo Nishimoto

Archive | 2006

CMP slurry for metallic film, polishing method and method of manufacturing semiconductor device

Gaku Minamihaba; Dai Fukushima; Nobuyuki Kurashima; Susumu Yamamoto; Hiroyuki Yano

Archive | 2001

Slurry for chemical mechanical polishing and manufacturing method of semiconductor device

Masayuki Hattori; Nobuo Kawahashi; Nobuyuki Kurashima; Fukugaku Minami; Kazuo Nishimoto; Hiroyuki Yano; 延行倉嶋; 学南幅; 信夫川橋; 雅幸服部; 博之矢野; 和男西元

Archive | 2007

Cleaning composition, cleaning method, and manufacturing method of semiconductor device

Michiaki Andou; Tomohisa Konno; Hirotaka Shida; Kazuhito Uchikura; Nobuyuki Kurashima; Gaku Minamihaba; Yoshikuni Tateyama; Hiroyuki Yano

Archive | 2004

Water dispersion for chemical mechanical polishing and chemical mechanical polishing method

Masaru Fukushima; Masayuki Hattori; Nobuo Kawahashi; Nobuyuki Kurashima; Yukiteru Matsui; Fukugaku Minami; Kazuo Nishimoto; Kazuichi Uchikura; Hiroyuki Yano; 延行倉嶋; 和一内倉; 学南幅; 信夫川橋; 雅幸服部; 之輝松井; 博之矢野; 大福島; 和男西元

Archive | 2006

Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion, chemical mechanical polishing process, and process for producing semiconductor devices

Hirotaka Shida; Akihiro Takemura; Masayuki Hattori; Gaku Minamihaba; Dai Fukushima; Nobuyuki Kurashima; Susumu Yamamoto; Yoshikuni Tateyama; Hiroyuki Yano

Archive | 2005