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Featured researches published by Do-Chan Choi.


IEEE Journal of Solid-state Circuits | 1997

A 3.3-V single power supply 16-Mb nonvolatile virtual DRAM using a NAND flash memory technology

Tae-Sung Jung; Do-Chan Choi; Sung-Hee Cho; Myong-Jae Kim; Seung-Keun Lee; Byung-Soon Choi; Jin-Sun Yum; San-Hong Kim; Dong-Gi Lee; Jong-Chang Son; Myung-Sik Yong; Heung-Kwun Oh; Sung-Bu Jun; Woung-Moo Lee; Ejaz Haq; Kang-Deog Suh; Syed Ali; Hyung-Kyu Lim

A 3.3-V 16-Mb nonvolatile memory having operation virtually identical to DRAM with package pin compatibility has been developed. Read and write operations are fully DRAM compatible except for a longer RAS precharge time after write. Fast random access time of 63 ns with the NAND flash memory cell is achieved by using a hierarchical row decoder scheme and a unique folded bit-line architecture which also allows bit-by-bit program verify and inhibit operation. Fast page mode with a column address access time of 21 ns is achieved by sensing and latching 4 k cells simultaneously. To allow byte alterability, nonvolatile restore operation with self-contained erase is developed. Self-contained erase is word-line based, and increased cell disturb due to the word-line based erase is relaxed by adding a boosted bit-line scheme to a conventional self-boosting technique. The device is fabricated in a 0.5-/spl mu/m triple-well, p-substrate CMOS process using two-metal and three-poly interconnect layers. A resulting die size is 86.6 mm/sup 2/, and the effective cell size including the overhead of string select transistors is 2.0 /spl mu/m/sup 2/.


symposium on vlsi circuits | 1994

Battery Operated 16m Dram With Post Package Programmable And Variable Self Refresh

Do-Chan Choi; Young-Rae Kim; Gi-Won Cha; Jae-Hyeong Lee; Sang-Bo Lee; Keum-Yong Kim; Ejaz Haq; Dong-Soo Jun; K. Y. Lee; Soo-In Cho; Jongwoo Park; Hyung-Kyu Lim

with wide operating voltage range of 1.8~ to 3.6~ for battery based portable applications. Low power during data retention is obtained with Vcc and temperature variable self refresh which is programmable after packaging using electrical fuses. High performance is achieved at low voltage with dual VPPs for well bias and on-chip high voltage power supply, dual threshold voltages for NMOS and voltage variable sensing control. The 16M has a measured RAS access time of 58ns at 1.8~ and 83°C. This paper describes a I6M DRAM


symposium on vlsi circuits | 1992

A 35 ns 64 Mb DRAM using on-chip boosted power supply

Dong-Jae Lee; Yong-sik Seok; Do-Chan Choi; Jae-Hyeong Lee; Young-Rae Kim; Hyeun-Su Kim; Dong-Soo Jun; Oh-Hyun Kwon

An on-chip boosted power supply is necessary for ease of layout and high speed in high density DRAMs. The technique of TTL conversion is a key to designing high speed DRAMs for 3-V operation. The authors present the generation and regulation of an on-chip power supply (V/sub pp/) within 50 mV of the optimum level during operation for a given V/sub cc/. In addition to the regulated V/sub cc/ scheme, improved interface circuit techniques are employed to achieve fast input and output conversion with good noise margins. An experimental 64-Mb DRAM is designed. A typical access time of 35 ns is obtained by measurement.<<ETX>>


international solid-state circuits conference | 1997

A 3.3 V 16 Mb nonvolatile virtual DRAM using a NAND flash memory technology

Tae-Sung Jung; Do-Chan Choi; Sung-Hee Cho; Myong-Jae Kim; Seung-Keun Lee; Byung-Soon Choi; Jin-Sun Yum; San-Hong Kim; Dong-Gi Lee; Jong-Chang Son; Myung-Sik Yong; Heung-Kwun Oh; Sung-Bu Jun; Woung-Moo Lee; Ejaz Haq; Kang-Deog Suh; Hyung-Kyu Lim

A 3.3V 16Mb nonvolatile memory has read and write operations fully DRAM-compatible except a longer RAS precharge time after write. Most systems with high-performance processors use a shadow nonvolatile memory uploaded to a fast DRAM to obtain zero wait-state performance. The introduced nonvolatile virtual DRAM (NVDRAM) eliminates the need for this redundancy, achieving high performance while reducing power consumption. Fast random access time (tRAC) with a NAND flash memory cell is achieved by using a folded bit-line architecture, and DRAM comparable column address access time (tkA) is achieved by sensing and latching 4k cells simultaneously.


Archive | 1992

Voltage pumping circuit for semiconductor memory devices

Chan-Sok Park; Young-Gwon Choi; Dong-Jae Lee; Do-Chan Choi; Dong-Soo Jun; Yong-sik Seok


Archive | 1990

Method for manufacturing a DRAM using selective epitaxial growth on a contact

Do-Chan Choi; Kyung-tae Kim


Archive | 1991

CMOS semiconductor device with (LDD) NMOS and single drain PMOS

Kyeong-tae Kim; Do-Chan Choi


Archive | 1996

Self-contained reprogramming nonvolatile integrated circuit memory devices and methods

Do-Chan Choi; Tae-Sung Jung; Woung-Moo Lee; Ejaz Haq; Syed Ali


Archive | 2006

Memory module and memory system

Hongkyun Kim; Do-Chan Choi


Archive | 1996

Nonvolatile semiconductor memory which is connectable to a DRAM bus

Do-Chan Choi; Woung-Moo Lee; Tae-Sung Jung; Syed Ali; Ejaz Haq

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