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Dominic Maier

Infineon Technologies

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Publication

Featured researches published by Dominic Maier.

Archive | 2010

Device Including an Encapsulated Semiconductor Chip and Manufacturing Method Thereof

Thorsten Meyer; Ludwig Heitzer; Dominic Maier

Archive | 2013

Molded Semiconductor Package with Backside Die Metallization

Ulrich Wachter; Veronika Huber; Thomas Kilger; Ralf Otremba; Bernd Stadler; Dominic Maier; Klaus Schiess; Andreas Schlögl; Uwe Wahl

Archive | 2013

Method of packaging integrated circuits and a molded substrate with non-functional placeholders embedded in a molding compound

Ulrich Wachter; Dominic Maier; Thomas Kilger

Archive | 2017

System and Method for a Transducer in an eWLB Package

Stephan Pindl; Daniel Lugauer; Dominic Maier; Alfons Dehe

Archive | 2016

Chip Package and a Method of Producing the Same

Dominic Maier; Alfons Dehe; Thomas Kilger; Markus Menath; Franz Xaver Muehlbauer; Daniel Porwol; Juergen Wagner

Archive | 2016

Method of Packaging Integrated Circuits

Ulrich Wachter; Dominic Maier; Thomas Kilger

Archive | 2014

Method of Packaging Integrated Circuits and a Molded Package

Ulrich Wachter; Dominic Maier; Thomas Kilger

Archive | 2014

Electrical Measurement Based Circuit Wiring Layout Modification Method and System

Gottfried Beer; Dominic Maier; Gerhard Metzger-brückl; Rainer Leuschner

Archive | 2014

PACKAGE ARRANGEMENT AND METHOD OF FORMING THE SAME

Gottfried Beer; Dominic Maier; Ulrich Wachter; Daniel Kehrer

Archive | 2013

Metal redistribution layer for molded substrates

Ulrich Wachter; Dominic Maier; Thomas Kilger

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Collaboration

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Thomas Kilger

Infineon Technologies

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Ulrich Wachter

Infineon Technologies

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Gottfried Beer

Infineon Technologies

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Daniel Kehrer

Infineon Technologies

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Klaus Schiess

Infineon Technologies

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Ralf Otremba

Infineon Technologies

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Bernd Stadler

Infineon Technologies

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Rainer Leuschner

Infineon Technologies

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Uwe Wahl

Infineon Technologies

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Veronika Huber

Infineon Technologies

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