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Dive into the research topics where Eiji Takai is active.

Publication


Featured researches published by Eiji Takai.


Archive | 2004

Electroless copper plating solution, electroless copper plating process and production process of circuit board

Takeyuki Itabashi; Hiroshi Kanemoto; Haruo Akahoshi; Eiji Takai; Naoki Nishimura; Tadashi Iida; Yoshinori Ueda


Archive | 2001

Wiring substrate and manufacturing method of the same along with electroless copper plating solution used therefor

Takeyuki Itabashi; Haruo Akahoshi; Eiji Takai; Naoki Nishimura; Tadashi Iida; Yoshinori Ueda


Archive | 2002

Wiring substrate and its making process and chemical copper plating solution therein

Takeyuki Itahashi; Haruo Akahoshi; Eiji Takai


Archive | 2001

Wiring substrate and an electroless copper plating solution for providing interlayer connections

Takeyuki Itabashi; Haruo Akahoshi; Eiji Takai; Naoki Nishimura; Tadashi Iida; Yoshinori Ueda


Archive | 2004

Method of manufacturing a wiring substrate and an electroless copper plating solution for providing interlayer connections

Takeyuki Itabashi; Haruo Akahoshi; Eiji Takai; Naoki Nishimura; Tadashi Iida; Yoshinori Ueda


Archive | 2000

Electroless copper plating machine, and multi-layer printed wiring board

Takeyuki Itabashi; Haruo Akahoshi; Tadashi Iida; Yoshinori Ueda; Eiji Takai; Naoki Nishimura


Archive | 2005

Electroless copper plating machine thereof, and multi-layer printed wiring board

Takeyiki Itabashi; Haruo Akahoshi; Tadashi Iida; Yoshinori Ueda; Eiji Takai; Naoki Nishimura


Journal of Japan Institute of Electronics Packaging | 2002

Development of Formaldehyde Free Electroless Copper Plating Solution

Takeyuki Itabashi; Haruo Akahoshi; Tadashi Iida; Eiji Takai; Naoki Nishimura


Archive | 1997

Manufacture of printed-wiring board, printed-wiring board and apparatus for manufacturing printed-wiring board

Mitsuhiro Inoue; Akiyoshi Kadoya; Terutake Kato; Kazuo Motobayashi; Hirotake Nakayama; Naoki Nishimura; Eiji Takai; Makio Watabe; 光博 井上; 浩偉 仲山; 輝武 加藤; 和夫 本林; 真貴雄 渡部; 尚樹 西村; 明由 角屋; 英次 高井


Archive | 2009

A wiring substrate and a manufacturing method thereof and chemical copper plating solution therein

Takeyuki Itahashi; Haruo Akahoshi; Eiji Takai; Shoju Nishimura; Tadashi Iida; Yoshikoto Ueda

Collaboration


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Naoki Nishimura

Japan Aerospace Exploration Agency

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Naoki Nishimura

Japan Aerospace Exploration Agency

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Hideo Honma

Kanto Gakuin University

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