Is this you? Create Your Porfile
Avatar

Eiji Takai

Hitachi

Network

Latest external collaboration on country level. Dive into details by clicking on the dots.

Explore More

Hotspot

Dive into the research topics where Eiji Takai is active.

Explore More

Publication

Featured researches published by Eiji Takai.

Archive | 2004

Electroless copper plating solution, electroless copper plating process and production process of circuit board

Takeyuki Itabashi; Hiroshi Kanemoto; Haruo Akahoshi; Eiji Takai; Naoki Nishimura; Tadashi Iida; Yoshinori Ueda

Archive | 2001

Wiring substrate and manufacturing method of the same along with electroless copper plating solution used therefor

Takeyuki Itabashi; Haruo Akahoshi; Eiji Takai; Naoki Nishimura; Tadashi Iida; Yoshinori Ueda

Archive | 2002

Wiring substrate and its making process and chemical copper plating solution therein

Takeyuki Itahashi; Haruo Akahoshi; Eiji Takai

Archive | 2001

Wiring substrate and an electroless copper plating solution for providing interlayer connections

Takeyuki Itabashi; Haruo Akahoshi; Eiji Takai; Naoki Nishimura; Tadashi Iida; Yoshinori Ueda

Archive | 2004

Method of manufacturing a wiring substrate and an electroless copper plating solution for providing interlayer connections

Takeyuki Itabashi; Haruo Akahoshi; Eiji Takai; Naoki Nishimura; Tadashi Iida; Yoshinori Ueda

Archive | 2000

Electroless copper plating machine, and multi-layer printed wiring board

Takeyuki Itabashi; Haruo Akahoshi; Tadashi Iida; Yoshinori Ueda; Eiji Takai; Naoki Nishimura

Archive | 2005

Electroless copper plating machine thereof, and multi-layer printed wiring board

Takeyiki Itabashi; Haruo Akahoshi; Tadashi Iida; Yoshinori Ueda; Eiji Takai; Naoki Nishimura

Journal of Japan Institute of Electronics Packaging | 2002

Development of Formaldehyde Free Electroless Copper Plating Solution

Takeyuki Itabashi; Haruo Akahoshi; Tadashi Iida; Eiji Takai; Naoki Nishimura

Archive | 1997

Manufacture of printed-wiring board, printed-wiring board and apparatus for manufacturing printed-wiring board

Mitsuhiro Inoue; Akiyoshi Kadoya; Terutake Kato; Kazuo Motobayashi; Hirotake Nakayama; Naoki Nishimura; Eiji Takai; Makio Watabe; 光博 井上; 浩偉 仲山; 輝武 加藤; 和夫 本林; 真貴雄 渡部; 尚樹 西村; 明由 角屋; 英次 高井

Archive | 2009

A wiring substrate and a manufacturing method thereof and chemical copper plating solution therein

Takeyuki Itahashi; Haruo Akahoshi; Eiji Takai; Shoju Nishimura; Tadashi Iida; Yoshikoto Ueda

Explore More

Collaboration

Dive into the Eiji Takai's collaboration.

Top Co-Authors
Avatar

Haruo Akahoshi

Hitachi

View shared research outputs
Top Co-Authors
Avatar

Tadashi Iida

Hitachi

View shared research outputs
Top Co-Authors
Avatar

Takeyuki Itabashi

Hitachi

View shared research outputs
Top Co-Authors
Avatar

Yoshinori Ueda

Hitachi

View shared research outputs
Top Co-Authors
Avatar

Naoki Nishimura

Japan Aerospace Exploration Agency

View shared research outputs
Top Co-Authors
Avatar

Naoki Nishimura

Japan Aerospace Exploration Agency

View shared research outputs
Top Co-Authors
Avatar

Hiroshi Kanemoto

Hitachi

View shared research outputs
Top Co-Authors
Avatar

Hideo Honma

Kanto Gakuin University

View shared research outputs
Top Co-Authors
Avatar

Takeshi Kobayashi

Kanto Gakuin University

View shared research outputs
Explore More
Researchain Logo
Decentralizing Knowledge