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Henry Descalzo Bathan

STATS ChipPAC Ltd

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Publication

Featured researches published by Henry Descalzo Bathan.

Archive | 2007

Semiconductor Device with Optical Sensor and Method of Forming Interconnect Structure on Front and Backside of the Device

Zigmund Ramirez Camacho; Henry Descalzo Bathan; Lionel Chien Hui Tay; Arnel Senosa Trasporto

Archive | 2010

Semiconductor device and method of forming through hole vias in die extension region around periphery of die

Henry Descalzo Bathan; Zigmund Ramirez Camacho; Lionel Chien Hui Tay; Arnel Senosa Trasporto

Archive | 2010

Semiconductor device and method of forming leadframe interposer over semiconductor die and TSV substrate for vertical electrical interconnect

Zigmund Ramirez Camacho; Dioscoro A. Merilo; Henry Descalzo Bathan; Emmanuel Espiritu

Archive | 2009

Leadframe design for QFN package with top terminal leads

Zigmund Ramirez Camacho; Henry Descalzo Bathan; Jose Alvin Caparas; Lionel Chien Hui Tay

Archive | 2011

Semiconductor device and method of forming wafer-level multi-row etched leadframe with base leads and embedded semiconductor die

Zigmund Ramirez Camacho; Emmanuel Espiritu; Henry Descalzo Bathan; Dioscoro A. Merilo

Archive | 2013

Semiconductor Device and Method of Forming a Wafer Level Package with Top and Bottom Solder Bump Interconnection

Zigmund Ramirez Camacho; Lionel Chien Hui Tay; Henry Descalzo Bathan; Dioscoro A. Merilo; Jeffrey D. Punzalan

Archive | 2010

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PLATED LEADS AND METHOD OF MANUFACTURE THEREOF

Zigmund Ramirez Camacho; Henry Descalzo Bathan; Lionel Chien Hui Tay

Archive | 2008

Semiconductor Device and Method of Forming a Wafer Level Package with Bump Interconnection

Zigmund Ramirez Camacho; Lionel Chien Hui Tay; Henry Descalzo Bathan; Jeffrey D. Punzalan

Archive | 2003

System for semiconductor package with stacked dies

Hyeong Ryeol Hur; Henry Descalzo Bathan; Zigmund Ramirez Camacho

Archive | 2010

Integrated circuit packaging system with pad connection and method of manufacture thereof

Zigmund Ramirez Camacho; Henry Descalzo Bathan; Emmanuel Espiritu; Dioscoro A. Merilo

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Collaboration

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Zigmund Ramirez Camacho

STATS ChipPAC Ltd

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Lionel Chien Hui Tay

STATS ChipPAC Ltd

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Jeffrey D. Punzalan

STATS ChipPAC Ltd

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Emmanuel Espiritu

STATS ChipPAC Ltd

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Jairus Legaspi Pisigan

STATS ChipPAC Ltd

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Arnel Senosa Trasporto

STATS ChipPAC Ltd

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Il Kwon Shim

STATS ChipPAC Ltd

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Dioscoro A. Merilo

STATS ChipPAC Ltd

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Jose Alvin Caparas

STATS ChipPAC Ltd

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Abelardo Hadap Advincula

STATS ChipPAC Ltd

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