Eunseok Cho

Thermoelectric cooling packages and thermal management methods thereof

Semiconductor packages including heat slugs

SEMICONDUCTOR PACKAGE HAVING HEAT SPREADER AND METHOD OF FORMING THE SAME

Semiconductor Devices And Methods Of Controlling Temperature Thereof

Electronic device and method for controlling temperature thereof

SURFACE TEMPERATURE MANAGEMENT METHOD OF MOBILE DEVICE AND MEMORY THERMAL MANAGEMENT METHOD OF MULTICHIP PACKAGE

Chip-on-film packages and device assemblies including the same

Multi-chip package with spacer for blocking interchip heat transfer

ELECTRONIC DEVICE AND TEMPERATURE CONTROL METHOD THEREOF

Package On Package Having Improved Thermal Characteristics