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Heung Kyu Kwon

Samsung

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Publication

Featured researches published by Heung Kyu Kwon.

Archive | 1998

Chip scale packages and methods for manufacturing the chip scale packages at wafer level

Nam Seog Kim; Dong Hyeon Jang; Sa Yoon Kang; Heung Kyu Kwon

Archive | 2005

Semiconductor wafer having electrically connected passive device chips, passive devices and semiconductor package using the same

Heung Kyu Kwon

Archive | 1993

Semiconductor lead frame with a chip having bonding pads in a cross arrangement

Dong Y. Oh; Hyeon J. Jeong; Heung Kyu Kwon

Archive | 2003

Method for manufacturing flip chip package devices with a heat spreader

Heung Kyu Kwon

Archive | 2001

Semiconductor package with ground projections

Heung Kyu Kwon; Tae Je Cho; Young Hoon Ro

Archive | 2000

Chip scale packages manufactured at wafer level

Nam Seog Kim; Dong Hyeon Jang; Sa Yoon Kang; Heung Kyu Kwon

Archive | 2005

Bonding configurations for lead-frame-based and substrate-based semiconductor packages and method of fabrication thereof

Kyung Lae Jang; Hee Seok Lee; Heung Kyu Kwon

Archive | 2005

MULTICHIP PACKAGE, SEMICONDUCTOR DEVICE USED FOR THE SAME, AND MANUFACTURING METHOD THEREOF

Heung Kyu Kwon; Hee-Seok Lee; 稀裼 李; 興奎 權

Archive | 2016

SEMICONDUCTOR CHIP, FLIP CHIP PACKAGE AND WAFER LEVEL PACKAGE INCLUDING THE SAME

Heung Kyu Kwon

Archive | 2017

SYSTEM MODULE AND MOBILE COMPUTING DEVICE INCLUDING THE SAME

Heung Kyu Kwon

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Hee Seok Lee

Samsung

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Kyung Lae Jang

Samsung

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Dong Hyeon Jang

Samsung

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Jae Sop Kong

Samsung

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Nam Seog Kim

Samsung

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Sa Yoon Kang

Samsung

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Taek Kyun Shin

Samsung

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Dong Y. Oh

Samsung

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Hee-Seok Lee

Samsung

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Hyeon J. Jeong

Samsung

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