Heung Kyu Kwon

Chip scale packages and methods for manufacturing the chip scale packages at wafer level

Semiconductor wafer having electrically connected passive device chips, passive devices and semiconductor package using the same

Semiconductor lead frame with a chip having bonding pads in a cross arrangement

Method for manufacturing flip chip package devices with a heat spreader

Semiconductor package with ground projections

Chip scale packages manufactured at wafer level

Bonding configurations for lead-frame-based and substrate-based semiconductor packages and method of fabrication thereof

MULTICHIP PACKAGE, SEMICONDUCTOR DEVICE USED FOR THE SAME, AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR CHIP, FLIP CHIP PACKAGE AND WAFER LEVEL PACKAGE INCLUDING THE SAME

SYSTEM MODULE AND MOBILE COMPUTING DEVICE INCLUDING THE SAME